The application of the sliding-mode control theory to the regulation of dc-to-dc switching converters is reviewed. Subsequently, linear dynamical models are derived and compensating networks are designed. An analog integrated circuit illustrating the theory has been designed, implemented and applied to regulate a buck converter in continuous conduction mode. Experimental verifications are provi...

Bonding wires are extensively used in integrated circuit (IC) packaging and circuit design in RF applications. An approach to fast three-dimensional (3-D) modeling of the geometry for bonding wires in RF circuits and packages is demonstrated. The geometry can readily be used to extract electrical parameters such as inductance and capacitance. An equivalent circuit is presented to model the freq...

Since the invention of the integrated circuit technologies, there has been an unprecedented growth of the electronic industry, with significant impact on the maritime industry. In the last twenty years and so, the strongest growth area of the electronic industry has been in CMOS VLSI technology. The sustained growth in CMOS VLSI technology is fueled by a continued shrinking of transistors to ev...

Developing virtual performanceand reliability predictive techniques has become essential for the development of (micro)electronic systems. This paper provides an overview of current predictive methodologies, challenges and requirements for the modeling of microelectronics thermal behavior. Critical modeling issues are discussed, from optimizing Integrated Circuit (IC) packaging thermal performa...

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Backside via self-inductance is a critical electrical quantity needed for the design of Monolithic Millimeter-wave Integrated Circuits (MMIC). We have investigated a simple, analytical method for accurately calculating via inductance based upon physical geometry. The analytical method enables backside via process development to be tailored to meet design goals. Conversely, the sensitivity of RF...

In this paper, we present design, implementation, and measurement of a three-dimensional (3-D)-deployed RF front-end system-on-package (SOP) in a standard multi-layer low temperature co-fired ceramic (LTCC) technology. A compact 14 GHz GaAs MESFET-based transmitter module integrated with an embedded band pass filter was built on LTCC 951AT tapes. The up-converter MMIC integrated with a voltage ...

The worldwide diffusion of wireless telecommunication systems opened new perspectives for microwave technologies. High-volume microwave monolithic integrated circuit (MMIC) production became a reality, revolutionizing the approach to microwave-circuit design. Nowadays, this is based on the intensive use of accurate simulation and computer-aided-design (CAD) tools. While scattering parameter mea...

© 2012 Nagendra Sekhar, licensee InTech. This is an open access chapter distributed under the terms of the Creative Commons Attribution License (http://creativecommons.org/licenses/by/3.0), which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. Mechanical Characterization of Black Diamond (Low-k) Structures for 3D Integrated C...

Graphene has attracted much interest as a future channel material in radio frequency electronics because of its superior electrical properties. Fabrication of a graphene integrated circuit without significantly degrading transistor performance has proven to be challenging, posing one of the major bottlenecks to compete with existing technologies. Here we present a fabrication method fully prese...