Micromechanical communication circuits fabricated via IC-compatible MEMS technologies and capable of low-loss filtering, mixing, switching, and frequency generation, are described with the intent to miniaturize wireless transceivers. Possible transceiver front-end architectures are then presented that use these micromechanical circuits in large quantities to substantially reduce power consumpti...

Third-order, micromechanical bandpass filters comprised of three folded-beam resonators coupled by flexural mode springs are demonstrated using an IC-compatible, polysilicon surface-micromachining technology. The use of quarter-wavelength coupling beams attached to resonators at their folding-trusses is shown to suppress passband distortion due to finite-mass nonidealities, which become increas...

Micromechanical communication circuits fabricated via IC-compatible MEMS technologies and capable of low-loss filtering, mixing, switching, and frequency generation, are described with the intent to miniaturize wireless transceivers. Possible transceiver front-end architectures are then presented that use these micromechanical circuits in large quantities to substantially reduce power consumpti...

MicroElectroMechanical Systems (MEMS) made of heterostructures of crystalline oxide materials with targeted physical properties may be applied as sensors having different integrated functionalities. In this work, we explore the feasibility of manganite thin film based epitaxial MEMS for thermometric micromechanical sensing. We investigate the mechanical properties of La1−xSrxMnO3, with x ≈ 1/3,...

Micromechanical (or “μmechanical) communication circuits fabricated via IC-compatible MEMS technologies and capable of low-loss filtering, mixing, switching, and frequency generation, are described with the intent to miniaturize wireless transceivers. Possible MEMS-based receiver front-end architectures are then presented that use these micromechanical circuits in large quantities to enhance ro...

Micromechanical communication circuits fabricated via IC-compatible MEMS technologies and capable of low-loss filtering, mixing, switching, and frequency generation, are described with the intent to miniaturize wireless transceivers. A possible transceiver front-end architecture is then presented that uses these micromechanical circuits in large quantities to substantially reduce power consumpt...

A general approach to the analysis of the dynamics of different types of micromechanical vibratory gyroscopes is considered in this paper. Specifically, we investigate and analyse the dynamics of singlemass gyroscopes for both fixed and rotating base. Generalized motion equations are derived and solved by means of method of averaging. Amplitude and phase responses of the sensitive element along...

Fully monolithic, high-Q, micromechanical signal processors are described. A completely monolithic high-Q oscillator, fabricated via a combined CMOS plus surface micromachining technology, is detailed, for which the oscillation frequency is controlled by a polysilicon micromechanical resonator to achieve high stability. The operation and performance of μmechanical resonators are modelled, with ...

Having now produced devices with sufficient Q, thermal stability, aging stability, and manufacturability, vibrating RF MEMS technology is already finding its way into next generation timing and wireless applications. At this juncture, the technology is now poised to take its next logical steps: higher levels of circuit complexity and integration. In particular, as vibrating RF MEMS devices are ...