in this study 121 prescapular, prefemoral and popliteal lymph node of male healthy camel from mashhad abattoir were collected. after collecting of specimens factors such as: length, width, thickness, weight, volume and density of each lymph node were measured by caliper device. all factors were analyzed and compared using excel program. it was revealed that, normal dimensions of right prescapul...

Nowadays, faults and failures are increasing especially in complex systems such as Network-on-Chip (NoC) based Systems-on-a-Chip due to the increasing susceptibility and decreasing feature sizes. On the other hand, fault-tolerant routing algorithms have an evident effect on tolerating permanent faults and improving the reliability of a Network-on-Chip based system. This paper presents reliabili...

in order to reduce wear in gudgeon pin, bush and piston boss lubrication is done. oil used in national engine species was 10w40 with dynamic viscosity 5.5 mpa.s at 140 °c (the working temperature). in order to complete investigation the oil film hydrodynamics analysis in small end of connecting rod, a real full model engine with four cylinders has been simulated by avl excite5.1 software. in th...

A novel fully integrated dynamic thermal management circuit for system-on-chip design is proposed. Instead of worst-case thermal management used in conventional systems, this design yields continual monitoring of thermal activity and reacts to specified conditions. With the above system, we are able to incorporate on-chip power/speed modulation and integrated multi-stage fan controllers, which ...

Current commercially available in vitro skin models do not fully reproduce the structure and function of native human skin, mainly due to their use animal-derived collagen lack a dynamic flow system. In this study, full-thickness skin-on-a-chip (SoC) system that reproduces key aspects vivo cellular microenvironment is presented. This approach combines production fibroblast-derived matrix (FDM) ...

The advantages of wafer level packaging (WLP) are widely recognized across a range of applications MEMS, IC’s Smart systems, CMOS-MEMS integration, System on Chip (SoC), Package in Package (PiP), Package on Package (PoP ) etc. Key benefits include true chip-size package, reduced cost of interconnects (by creating at wafer-level rather than back-end chip-scale packaging), and minimising test and...

Conventional time domain rake combining can be replaced by minimum mean square error frequency domain equalisation (MMSE–FDE) with much better performance in a frequencyselective fading channel, since the frequency selectivity of the channel is thoroughly exploited. Chip interleaving is a form of channel interleaving that improves the DS–CDMA performance by taking advantage of the time selectiv...