In 2013 the Alphasat spacecraft will be launched: in addition to its main commercial payload, four Technology Demonstration Payloads (TDPs) will fly on-board. The different payloads are provided by different research institutes, which will be able to define in-orbit demonstration tests of these new technologies. To optimize this opportunity, coordination of the different, possibly conflicting, ...

BACKGROUND Monitoring core body temperature to identify heat stress in first responders and in individuals participating in mass gatherings (e.g., marathons) is difficult. OBJECTIVE This study utilized high-sensitivity thermal imaging technology to predict the core temperature of human subjects at a distance while performing simulated field operations wearing thermal protective garments. ME...

With the increase in consumer awareness, demand for minimally processed foods and ecofriendliness, various technologies were developed for food processing and preservation. The conventional thermal food preservation and processing techniques appears to have the shortcoming of adversely affecting the food quality, organoleptic properties and nutrients. However, many non-thermal food preservation...

As the electronics industry moves toward smaller form and fit factors, advanced packaging technologies are needed to achieve these challenging design requirements. Current design problems are not driven by circuit design capabilities but by an inability to reliably package these circuits within the space constraints. Innovative packaging techniques are required in order to meet the increasing s...

With the increase in consumer awareness, demand for minimally processed foods and ecofriendliness, various technologies were developed for food processing and preservation. The conventional thermal food preservation and processing techniques appears to have the shortcoming of adversely affecting the food quality, organoleptic properties and nutrients. However, many non-thermal food preservation...

CMOS VLSI technology has been facing various technical challenges as the feature sizes scales down. To overcome the challenges imposed by the shrink of the conventional on-chip interconnect system in IC chips, alternative interconnect technologies are being developed: one of them is three dimensional chips (3D ICs). Even though 3D IC technology is a promising solution for interconnect bottlenec...

One of the most important issues whether anisotropic conductive film (ACF) interconnection technology is suitable to be used for flip chip on organic board applications is thermal cycling reliability. In this study, thermally induced deformations and warpages of ACF flip chip assemblies as a function of distance from neutral point (DNP) and ACF materials properties were investigated using in si...

On account of the trend of the latest microelectronic technology to become progressively smaller, it becomes increasingly important to predict the thermal behavior of constituent materials. Among the most promising candidates for use in microelectronics and thermal conductors are carbon nanotubes (CNTs). Thermal properties of such small scale components are difficult to measure experimentally. ...

Metal organic framework-5 (MOF-5)was recently suggested to possess an exceptionally large negative thermal-expansion coefficient. Our direct experimental measurement of the thermal expansion of MOF-5 using neutron powder diffraction, in the temperature range of 4 to 600 K, shows that the linear thermalexpansion coefficient is ≈−16×10−6 K−1. To understand the origin of this large negative therma...

With the rise of many-core chips that require substantial bandwidth from the network on chip (NoC), integrated photonic links have been investigated as a promising alternative to traditional electrical interconnects. While numerous optoelectronic NoCs have been proposed, evaluations of photonic architectures have thus-far had to use a number of simplifications, reflecting the need for a modelin...