GaAs etch characteristics like etch rate, etch profile sidewall angle, etch surface morphology and selectivity are studied as a function of Inductively Coupled Plasma (ICP) power and Cl2/BCl3 flow rate ratio in ICP at low pressure (<15mTorr) and low RF bias power (<100W) regime to achieve moderate GaAs etch rate with an-isotropic profiles and smooth surface morphology. The low pressure regime e...

Grass’ formation is the very common defects for via etch process when using a BCl3/Cl2 as basic gases in an inductively coupled plasma (ICP) system. Presence of grass can potentially degrade device performance due to poor metallization coverage. In this study we found that grass formation strongly depends on GaAs surface condition prior to etch. Any surface contaminants, such as photo resist re...

This literature review article addresses the types and the main components of different etch-and-rinse and self-etch adhesive systems available in the market, and relates them to their function, possible chemical interactions and influence of handling characteristics. Scanning electron microscopy (SEM) images are presented to characterize the interface between adhesives and dentin. Adhesive sys...

This paper reflects on the state of the art of self-etch adhesives anno 2010. After presenting the general characteristics of self-etch adhesives, the major shortcomings of the most simple-to-use one-step (self-etch) adhesives are addressed. Special attention is devoted to the AD-concept and the benefit of chemical interfacial interaction with regard to bond durability. Finally, issues like the...

At Skyworks Solutions throughput of the back side through-wafer via etch process was low because of a high rework rate. The high rework rate was due to an organic residue blocking the etch. A process was first developed to remove the residue and then integrated into the via etch process. The optimized via etch process resulted in a reduction in reworks and a significant increase in process thro...

Our experiment evaluated the microleakage in resin composite restorations bonded to dental tissues with different adhesive systems. 40 class V cavities were prepared on the facial and lingual surfaces of each tooth with coronal margins in enamel and apical margins in cementum (root dentin). The teeth were restored with Z100 resin composite bonded with different adhesive systems: Scotchbond Mult...

—We present ETCH, efficient channel hopping based MAC-layer protocols for communication rendezvous in Dynamic Spectrum Access (DSA) networks. Compared to the existing solutions, ETCH fully utilizes spectrum diversity in communication rendezvous by allowing all the rendezvous channels to be utilized at the same time. We propose two protocols, SYNC-ETCH, which is a synchronous protocol assuming D...

statement of problem: despite the increasing demand for tooth-colored restorations in dentistry, polymerization shrinkage and marginal microleakage still remains a problem. objectives: the purpose of the present study was to evaluate microleakage in three different resin composites, p90, z250 and z250 xt, in class v cavity of permanent human premolars. materials and methods: standardized class ...