A new package for power semiconductors has been developed: Power semiconductor chips are soldered onto a DCB ceramic substrate together with a lead frame with up to ve pins. Subsequently chips and DCB are covered by molding compound. This packaging method combines the technologies of module and discrete assembly. Thus the resulting component provides a combination of the characteristics of both...

Abstract--Results of a numerical simulation, based on an energy consistent moving singularity dynamic finite element procedure, of fast crack propagation and arrest in a high strength steel DCB specimen are presented. The influence of material properties of high strength steel on dynamic crack propagation and arrest is investigated. The influence of the loss of constact of specimen with the loa...

A laser photochemical process is introduced to realize superhydrophobic conducting carbon coatings with broccoli-type hierarchical morphology for use as a metal-free counter electrode in a dye sensitized solar cell. The process involves pulsed excimer laser irradiation of a thin layer of liquid haloaromatic organic solvent o-dichlorobenzene (DCB). The coating reflects a carbon nanoparticle-self...

Two novel betaine surfactants with distinct hydrophilic headgroups were synthesized, including carboxybetaine surfactant (DCB) and sulfobetaine (DSB). Their properties of reducing the interfacial tension (IFT) Xinjiang crude oil/water studied under alkaline-free conditions, as their thermal stability, wettability, emulsification properties. The chemical structures target products characterized ...

Cohesive zone models are commonly used to numerically model fracture phenomena on the microscale. Typical processes described experimentally via Double Cantilever Beam (DCB) test and End Notched Flexure (ENF) macroscale. Analytical solutions, e.g. LEFM-based beam theory, evaluate these tests validate numerical models. However, some input parameters of cohesive models, i.e. stiffness strength, i...

Adhesively bonded joints are commonly used in airframe structures due to their superior strength to weight ratio, lower maintenance cost, and longer service life. The bonded joint reliability is affected by the environmental conditions, such as moisture, temperature, and service environment. In this study, the role of contamination during the bonding process on the joint mechanical integrity is...