نتایج جستجو برای: 10 d
تعداد نتایج: 1508268 فیلتر نتایج به سال:
Journal:
:Physics Letters B
1987
2012
Dae Hyun Kim
Krit Athikulwongse
Michael Healy
Mohammad Hossain
Moongon Jung
Ilya Khorosh
Gokul Kumar
Young-Joon Lee
Dean Lewis
Tzu-Wei Lin
Chang Liu
Shreepad Panth
Mohit Pathak
Minzhen Ren
Guanhao Shen
Taigon Song
Dong Hyuk Woo
Xin Zhao
Joungho Kim
Ho Choi
Gabriel Loh
Hsien-Hsin Lee
Sung Kyu Lim
Several recent works have demonstrated the benefits of through-silicon-via (TSV) based 3D integration [1-4], but none of them involves a fully functioning multicore processor and memory stacking. 3D-MAPS (3D Massively Parallel Processor with Stacked Memory) is a two-tier 3D IC, where the logic die consists of 64 general-purpose processor cores running at 277MHz, and the memory die contains 256K...
Journal:
:Nucleic Acids Research
1990
Journal:
:YAKUGAKU ZASSHI
1980
Journal:
:Marine Engineering
2012
Journal:
:Physics Letters B
1994
Journal:
:Journal of High Energy Physics
2011
نمودار تعداد نتایج جستجو در هر سال
با کلیک روی نمودار نتایج را به سال انتشار فیلتر کنید