نتایج جستجو برای: chip formation

تعداد نتایج: 576949  

Journal: :Chinese journal of mechanical engineering 2021

Abstract Inconel 718, a nickel, chrome and iron alloy, has special advantages, such as high-temperature strength, thermal resistance corrosion resistance, which facilitate wide usage in the aerospace industry, especially hot sections of gas turbine engines. However, machining this alloy is correlated closely with material’s inherent properties excellent combination hardness toughness, low condu...

Journal: :Journal of manufacturing and materials processing 2023

The paper presents the microstructural characterization of chip roots in high-speed steels and ceramic Ti3SiC2. process formation obtaining adequate samples were carried out using quick-stop method. tests during milling process; “quick stop” method was order to obtain roots. This developed in-house by authors. microscopically studied means a light microscope (LM) scanning electron (SEM). Before...

Journal: :Journal of the Japan Society for Precision Engineering 1993

Journal: :Fluids 2023

The formation of droplets in microchannels (droplet microfluidics) has a large number applications, such as micro-dosing and gas meters. This paper considers the dynamics direct inverse emulsions based on water, polydimethylsiloxane, synthetic mineral oil microfluidic chips two technologies: glass–parafilm–glass sandwich structures removable scaffold silicone compound. It is shown that wettabil...

Journal: :Journal of the Japan Society for Precision Engineering 1988

Journal: :The International Journal of Advanced Manufacturing Technology 2023

Abstract Titanium and titanium alloys have high strength at low density, good corrosion resistance excellent biocompatibility. Therefore, the use of materials is well established in high-performance applications such as aerospace biomedical. However, Ti–6Al–4 V thermal conductivity, exhibit unfavorable chip formation with typical segmented chips chemical affinity to surrounding elements oxygen....

1999
Aicha Elshabini

This thesis presents the low cost process for UBM formation on aluminum pads of single die/dice for Flip Chip applications. The UBM (Under Bump Metallization) is required in solder bump structure to provide adhesion/diffusion barrier layer, solder wettable layer, and oxidation barrier layer between the bonding pads of the die and the bumps. Typically, UBM is deposited on the whole wafers by spu...

Journal: :Micromachines 2015
Wenfeng Wan Gaole Dai Lijun Zhang Yajing Shen

Hydrogel has been regarded as one significant biomaterial in biomedical and tissue engineering due to its high biocompatibility. This paper proposes a novel method to pattern calcium alginate hydrogel in a 3D way via electrodeposition process based on a piece of paper. Firstly, one insulating paper with patterned holes is placed on one indium tin oxide (ITO) glass surface, which is put below an...

By increasing, the complexity of chips and the need to integrating more components into a chip has made network –on- chip known as an important infrastructure for network communications on the system, and is a good alternative to traditional ways and using the bus. By increasing the density of chips, the possibility of failure in the chip network increases and providing correction and fault tol...

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