This Note describes the suitability of a number of techniques of potential use in studying cracking in lead-free solder joints, and hence their use in assessing joint lifetimes. Cracks induced into solder joints of chip resistors on FR4 substrates, were studied using micro-sectioning, dye penetration, mechanical test and thermal conductivity techniques. The work previously reported [1] has been...

There are few experimental results to date describing the crack-propagation threshold behavior of short fatigue cracks under multiaxial loading conditions. To address this need, in the present study, the variation in mixed-mode, high-cycle fatigue-crack growth thresholds with crack size and shape are reported for a Ti-6Al-4V turbine blade alloy, heat treated to two widely different microstructu...

In this article, high-speed photographic investigations of the dynamic crack initiation and propagation in several inorganic glasses by the impact of small spherical and conical projectiles are described. These were carried out at speeds of up to approximately 2×10(6) frames s(-1). The glasses were fused silica, 'Pyrex' (a borosilicate glass), soda lime and B(2)O(3). The projectiles were 0.8-2 ...

Abstract. Experiments were performed to observe the fracture behavior of thinwall and initially-flawed aluminum tubes to internal gaseous detonation loading. The load can be characterized as a propagating pressure jump with speed of 2.4 km/s and magnitude ranging from 2 to 6 MPa, followed by an expansion wave. Flaws were machined as external axial surface notches. Cracks ran both in the upstrea...

Bone is more difficult to break than to split. Although this is well known, and many studies exist on the behaviour of long cracks in bone, there is a need for data on the orientation-dependent crack-growth resistance behaviour of human cortical bone that accurately assesses its toughness at appropriate size scales. Here, we use in situ mechanical testing to examine how physiologically pertinen...

This paper develops the extended finite element method (XFEM) to evolve patterns of multiple cracks, in a brittle thin film bonded to an elastic substrate, with a relatively coarse mesh, and without remeshing during evolution. A shear lag model describes the deformation in three dimensions with approximate field equations in two-dimensions. The film is susceptible to subcritical cracking, obeyi...