Thin palladium acetate films have been used for laser deposition (or prenucleation) of palladium lines, which can be used as a catalyst for electroless plating of other metals, notably Cu, to build up thicker conductors. This palladium deposition process was carried out using a CW argon ion laser at 514.5 nm for the first time in 1987 [l] then at 351 nm [2]. This visible-laser-induced depositio...

Copper films were grown on (3-Mercaptopropyl)trimethoxysilane (MPTMS), (3-Aminopropyl)triethoxysilane (APTES) and 6-(3-(triethoxysilyl)propylamino)-1,3,5- triazine-2,4-dithiol monosodium (TES) self-assembled monolayers (SAMs) modified acrylonitrile-butadiene-styrene (ABS) substrate via electroless copper plating. The copper films were examined using scanning electron microscopy (SEM) and X-ray ...

An electroless deposition method comprised of seed formation and subsequent seeded growth is developed for the decoration of surface-grown single-walled carbon nanotubes (SWCNTs) with gold nanoparticles of controlled size and interparticle distance. The density of the gold nanoparticles is determined by the density of seeds. Gold seeds are used for the SWCNT arrays grown on SiO(x)/Si substrates...

In this project work Si nanowires were fabricated on the Si substrate by aqueous method. In this aquoues method Ag is used for electroless chemical etching. The precursors those were taken are AgNO3, HF and H2O2. Si nanowires are fabricated at 550C. The samples were characterized by X-ray diffraction and scanning electron microscope. Result shows morphology of the Si nanowires by scanning elect...

In this study we consider copper sample as a substrate under which the Electroless Ni-W-P coatings were established and successfully deposited. The three factor was taken into consideration, i.e. concentration of Nickel Sulphate, Sodium Hypophosphite Tungstate Dihydrate. Central Composite Design modelling done with help total 20 runs that conducted in design, mass deposition per unit area respo...