نتایج جستجو برای: hybrid acdc micro grid

تعداد نتایج: 382780  

Journal: :Energy Reports 2023

In a solar micro-grid, hybrid renewable energy system generates electricity for building’s onsite use. The battery storage and the main power grid connection are used to facilitate matching between demand production. To control flows optimally, an accurate day-ahead prediction of photovoltaic (PV) panels output is required. However, this challenging task due fluctuating nature radiation availab...

2012
Sankar Ram

This paper deals with the resource scheduling algorithm for multi cluster hybrid grid environment. The combination of both the centralized and decentralized grid environments is collectively called as the hybrid grid environment. In this environment, each cluster has its own scheduler and cluster information system, and the whole organization is managed by one global grid scheduler with a grid ...

Journal: :journal of artificial intelligence in electrical engineering 2013
oveis abedinia ali ghasemi noradin ghadimi

plug-in hybrid electric vehicles (phev) technology shows great interest in the recent scientificliteratures. vehicle-to-grid (v2g) is a interconnection of energy storage of phevs and grid. byimplementation of v2g dependencies of the power system on small expensive conventional units canbe reduced, resulting in reduced operational cost. this paper represents an intelligent unitcommitment (uc) wi...

2015
Manoj Kumar Bhardwaj

This paper is describing about design and implementation of multi agent system in intelligent distributed autonomous power system (IDAPS) for a smart grid called micro grid for optimal load scheduling network. The different control architecture contains agents like Load agent, Control agent, and DER agent which are responsible for quick action for micro grid control. The multi agent controller ...

Journal: :Appl. Soft Comput. 2016
Tsung-Nan Tsai Mika Liukkonen

Solder paste is the main soldering material used to form strong solder joints between printed circuit boards (PCB) and surface mount devices in the surface mount assembly (SMA). On average 60% of endof-line soldering defects can be attributed to inadequate performance of solder paste stencil printing. Recently, lead-free solder paste has been adopted by electronics manufacturers in compliance w...

Journal: :Energy and Power Engineering 2013

Journal: :Journal of Electrical Engineering 2016

Journal: :IOSR Journal of Electrical and Electronics Engineering 2013

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