نتایج جستجو برای: interfacial adhesion

تعداد نتایج: 103962  

Journal: :Proceedings of the Institution of Mechanical Engineers, Part L: Journal of Materials: Design and Applications 2010

2015
Wei Gao Kenneth M. Liechti Rui Huang

Interfacial adhesion between graphene and various substrate materials is essential for practical applications of graphene. To date, most of the studies on adhesion of graphene have assumed dry adhesion of van der Waals type. In this paper, we conduct molecular dynamics simulations to study the traction–separation behaviors for wet adhesion of graphene on amorphous silicon oxide covered by a thi...

2018
Zhi-xin Yang Jun-yi Sun Ke Li Yong-sheng Lian Xiao-ting He

In this study, based on the pressure blister test technique, a theoretical study on the synchronous characterization of surface and interfacial mechanical properties of thin-film/substrate systems with residual stress was presented, where the problem of axisymmetric deformation of a blistering film with initial stress was analytically solved and its closed-form solution was presented. The expre...

Journal: :Friction 2023

Abstract The interfacial adhesion between microstructures is inevitable in a micro-electro-mechanical system (e.g., hard disk drive (HDD)), which may lead to complicated microtribodynamics problems. This research has investigated the effect of surface potential on and head–disk interface (HDI) an HDD. A dynamic continuum force model, where electrowetting considered, proposed evaluate interactio...

Journal: :Journal of bacteriology 2007
Arzu Atabek Terri A Camesano

The roles of lipopolysaccharides (LPS) and extracellular polymers (ECP) on the adhesion of Pseudomonas aeruginosa PAO1 (expresses the A-band and B-band of O antigen) and AK1401 (expresses the A-band but not the B-band) to silicon were investigated with atomic force microscopy (AFM) and related to biopolymer physical properties. Measurement of macroscopic properties showed that strain AK1401 is ...

Journal: :Physical chemistry chemical physics : PCCP 2017
Nathan W Ulrich John Andre Jaimal Williamson Kang-Wook Lee Zhan Chen

Adhesion is important in many industrial applications including those in the microelectronics industry. Flip-chip assemblies commonly utilize epoxy underfills to promote reliability and the buried interfacial structure of underfills is crucial to device lifetime. Poor adhesion at this interface can cause premature device failure. One method to increase adhesion strength is to plasma treat the s...

2006
Dongwen Gan Paul S. Ho Yaoyu Pang Rui Huang Tracey Scherban

The present study investigated the effect of passivation on the kinetics of interfacial mass transport by measuring stress relaxation in electroplated Cu films with four different cap layers: SiN, SiC, SiCN, and a Co metal cap. Stress curves measured under thermal cycling showed different behaviors for the unpassivated and passivated Cu films, but were essentially indifferent for the films pass...

Journal: :Proceedings of the National Academy of Sciences of the United States of America 2008
Sascha Hilgenfeldt Sinem Erisken Richard W Carthew

In multicellular organisms, cells pack together to form tissues of intricate and well defined morphology. How such cell-packing geometries arise is an important open question in biology, because the functionality of many differentiated tissues depends on their reliable formation. We show that combining adhesive forces due to E- and N-cadherin with a quantitative description of cell membrane ela...

نمودار تعداد نتایج جستجو در هر سال

با کلیک روی نمودار نتایج را به سال انتشار فیلتر کنید