This study compared fabr/cation of silver solder joints by dental students using an orthodontic blowpipe .or a Hydroflame ® soldering unit. Fifty-eight students attended a lecture and observed demonstrations of silver solder/ng. Thirty students used a Hydroflame ® to prepare one practice solder joint and two technique solder joints. These students then prepared one practice solder joint and two...

In my research a 3D model was created to investigate the restoring force arising and the self-alignment occurring during reflow soldering; and simulations were performed to examine the assumptions given by the model. Besides, experiments were carried out to verify both the assumptions and the simulation predictions. Passive components with the size of 0603 (1.5 x 0.75 mm) were placed with inten...

The push for lead-free or RoHS-compliant products is resulting in significant changes in packaging materials. Manufacturers of electronic equipment require materials that consistently withstand peak reflow temperatures of 240°C to 260°C. Reflow soldering at these extreme temperatures, especially after extended moisture exposure, introduces several challenges that must be solved to produce relia...

This paper describes the process of bonding a MEMS (Micro-ElectroMechanical System) microgripper to the distal end of a robotic manipulator arm using a molten solder bonding technique. This task is part of ongoing work which involves the development of a general microassembly workstation. The goal of this workstation is to construct 3-D microstructures from MEMS subcomponents. The microgrippers...

The aim of the research work was to characterize soldering alloy type Bi-Ag-Ti and study direct silicon copper. Bi11Ag1.5Ti solder has a broad melting interval. Its scope depends mainly on content silver titanium. begins melt at temperature 262.5 ?C full is completed 405 ?C. microstructure consists bismuth matrix with local eutectics. crystals titanium phases as BiTi2 Bi9Ti8 are segregated in m...