نتایج جستجو برای: thermal contact conductance

تعداد نتایج: 409449  

1995
Martin R. Zirnbauer

The conductance coefficients of disordered mesoscopic devices with n probes are investigated within the noninteracting electron approximation at zero temperature. The probes are eliminated from the theoretical description at the expense of introducing non-local boundary conditions at the position of the contacts. Conductors with a large number of weak contacts are analyzed in detail. The ensemb...

Journal: :Physical review letters 2002
J G Rodrigo A García-Martín J J Sáenz S Vieira

Electronic transport properties of bismuth nanocontacts are analyzed using a low temperature scanning tunneling microscope. The subquantum steps observed in the conductance versus elongation curves give evidence of atomic rearrangements in the contact. The quantum nature of the conductance reveals itself through peaks in the conductance histograms. The shape of the curves at 77 K is described b...

2000
JOHN A. PELESKO GREGORY A. KRIEGSMANN G. A. KRIEGSMANN

The microwave heating of a ceramic composite is modelled and analysed. The composite consists of many small ceramic particles embedded in a ceramic cement. The composite is assumed to be well insulated, and each particle is assumed to be in imperfect thermal contact with the surrounding cement. Based on these two assumptions an asymptotic theory exploiting the small Biot number and small non-di...

2015
Mingchao Wang Dilini Galpaya Zheng Bo Lai Yanan Xu Cheng Yan

(2014) Surface functionalization on the thermal conductivity of graphene–polymer nanocomposites. which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. The moral rights of the named author(s) have been asserted. Notice: Changes introduced as a result of publishing processes such as copy-editing and formatting may not be reflec...

2006
Shigeo MARUYAMA Yasuhiro IGARASHI Yuki TANIGUCHI Junichiro SHIOMI

Heat transfer of single-walled carbon nanotubes (SWNTs) in practical situations is investigated using molecular dynamics (MD) simulations. Attenuation of the expected high thermal conductivity was simulated by mixing C isotope impurities to SWNTs or binding two SWNTs with different chirality with a junction structure in between. The heat transfer through the junction can be expressed with the t...

2012
Daniel D. Nguyen

This projects attempts to simulate accurately the thermal conductivity of honeycomb panels in the normal direction. Due to the large empty space of the honeycomb core, the thermal radiation mode of heat transfer was modeled along with conduction. Using Newton’s Method to solve for a steady state model of heat moving through the honeycomb panel, the theoretical effective thermal conduction of th...

پایان نامه :وزارت علوم، تحقیقات و فناوری - دانشگاه شهرکرد 1387

چکیده ندارد.

2004
M. Bahrami M. M. Yovanovich E. E. Marotta

A compact analytical model is developed for predicting thermal joint resistance of rough polymer-metal interfaces in a vacuum. The joint resistance includes two components: i) bulk resistance of the polymer and ii) micro, constriction/spreading resistance of the microcontacts at the interface. Performing a deformation analysis, it is shown that the deformation mode of the polymer asperities is ...

Journal: :Physical review letters 1996
Rubio Agraït Vieira

Measuring simultaneously the force and the conductance during the formation and rupture of an atomic-sized gold contact at room temperature, we observe that deformation occurs as a sequence of structural transformations involving elastic and yielding stages and that force and conductance before rupture have definite values which are likely to correspond to a single atom contact. We measure the ...

2007
Patrick E. Hopkins P. M. Norris

With the ever-decreasing size of microelectronic devices, growing applications of superlattices, and development of nanotechnology, thermal resistances of interfaces are becoming increasingly central to thermal management. Although there has been much success in understanding thermal boundary conductance at low temperatures, the current models applied at temperatures more common in device opera...

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