The problem of crack branching and deflection in bi-material system is considered in this paper. The combinations may be piezoelectric-piezoelectric, or piezoelectric and non-piezoelectric. Based on Stroh's formulation for anisotropic material, Green's functions for various bi-material combinations are presented within the framework of two-dimensional electro-elasticity, allowing the crack prob...

In this paper we address the chip-level thermal simulation problem. Our work is based on some early results treating electro-thermal problems on circuit level 11, 22. The developed electro-thermal simulation package has been integrated under Cadence DFWII Opus. Due to its relatively low CPU need this package can be used as a thermal veriication tool of layouts of analog circuits. In our approac...

Electro-thermally actuated origami provides a novel method for creating 3-D systems with advanced morphing and functional capabilities. However, it is currently difficult to simulate the multi-physical behavior of such because electro-thermal actuation large folding deformations are highly interdependent. In this work, we introduce rapid multi-physics simulation framework electro-thermally that...