Scheduling of semiconductor wafer fabrication system is identified as a complex problem, involving multiple and conflicting objectives (meeting due dates and minimizing waiting time for instance) to satisfy. In this study, we propose an effective approach based an artificial neural network technique embedded in a multiobjective optimization loop for multi-decision scheduling problems in a semic...

An electrostatically driven micromirror is described. The vertical comb of a three-dimensional microstructure is realized by bending the device wafer having microstructures. By resetting the bending angle, the tuning of the vertical gap between moving and stationary combs is possible. The characteristics of the vertical comb drive actuator can be tuned, confirming the performance. key words: mi...

Chip-to-chip interconnection, based on wireless communication by capacitive coupling was investigated. This innovative approach will considerably reduce the pitch of the pin and strongly help in the implementation of a dense network of interconnects, while improving inter-chip bandwidth and power dissipation. The 3D integration technology based on aligned wafer-to-wafer direct bonding technique...

Accurate multi-level overlay capability for nanoimprint lithography (NIL) is essential to integrated circuit manufacturing and other multilayer imprint applications. Using the "beat" grating image (Moiré fringe) generated by overlaying two sets of gratings that have slightly different periods, we obtained an alignment signal with a sensitivity better than 10 nm in nanoimprint lithography. The a...

Traditional texture analysis by XRD has two drawbacks when applied to semiconductor test structures on a full size wafer: it lacks precision in positioning of a small diameter x-ray beam with respect to small, discreet test structures (hundreds of microns or less) on a large wafer, and it lacks appropriate algorithms for calculating the orientation distribution function in the case of very shar...

This thesis describes heterogeneous integration methods for the fabrication of microelectromechanical systems (MEMS). Most MEMS devices reuse the fabrication techniques that are found in the microelectronics integrated circuit industry. This limits the selection of materials and processes that are feasible for the realization of MEMS devices. Heterogeneous integration methods, on the other hand...

BACKGROUND 3-bromopyruvate (3-BrPA) and dichloroacetate (DCA) are inhibitors of cancer-cell specific aerobic glycolysis. Their application in glioma is limited by 3-BrPA's inability to cross the blood-brain-barrier and DCA's dose-limiting toxicity. The safety and efficacy of intracranial delivery of these compounds were assessed. METHODS Cytotoxicity of 3-BrPA and DCA were analyzed in U87, 9L...

Our previous work on spatial non-uniformities in deep-reactive ion etch (DRIE) has provided a method by which an etching tool and associated “recipes” of operating parameters may be pre-characterized [1]. That work allowed the wafer-average pattern opening density (or “loading”) to be related to waferscale etch rate variations. Such variations have been attributed to loading-dependent interacti...

This paper presents a high-Q resonant pressure microsensor with through-glass electrical interconnections based on wafer-level MEMS vacuum packaging. An approach to maintaining high-vacuum conditions by integrating the MEMS fabrication process with getter material preparation is presented in this paper. In this device, the pressure under measurement causes a deflection of a pressure-sensitive s...