The Maximum Density Sill-Life Problem is to fill an n × n board of cells with the maximum number of live cells so that the board is stable under the rules of Conway’s Game of Life. We reformulate the problem into one of minimising “wastage” rather than maximising the number of live cells. This reformulation allows us to compute strong upper bounds on the number of live cells. By combining this ...

This work describes a novel smart three axis compliant (STAC) interconnect targeted to revolutionize chipto-chip and chip-to-board high-density three dimensional (3D) integration for ultra-thin Si dies (≤ 75 μm) at the wafer level. The STAC interconnect is a 3D-compliant interconnect which allows stacked ultra-thin chips to move or flex freely during operation with negligible stress imposed on ...

The usability of lavender stems along with red pine chips was investigated as raw materials in the production of particleboard. Medium-density particleboard was manufactured using urea formaldehyde glue at three different ratios for five different mixture groups containing lavender stems and red pine chips. Some physical and mechanical properties of the boards were investigated. According to th...