Comparative studies on resin-dentin bond strength and failure mode were performed between the conventional tensile test and the microtensile test with non-trimming small specimens, 1 x 1 mm in cross-section, for two brands of dentin bonding systems. The fracture surface of the conventional large specimen showed a catastrophic cohesive failure in dentin at its center and a lesser adhesive failur...

The electronic structure for a representative late-transition-metal-methylene complex, Ru=€H2+, has been studied by ab initio methods (generalized valence bond/configuration interaction). The electronic-state spectrum reveals five states close in energy (spread of 12.9 kcal/mol) that partition into two groups in terms of energy separation and mode of metal-carbon bonding. The ground state has *...

In advanced microsystems various types of devices (metal-oxide semiconductor field-effect transistors, bipolar transistors, sensors, actuators, microelectromechanical systems, lasers) may be on the same chip, some of which are 3D structures in nature. Therefore, not only materials combinations (integrated materials) are required for optimal device performance of each type but also process techn...

The objective of this study was to compare the cytotoxicity of four orthodontic bonding systems, Light Bond, Enlight, Concise, and Transbond, and to evaluate their shear bond strength (SBS). These orthodontic bonding materials were applied to metal brackets (Mini Diamond). Glass specimens were used as controls in all experiments. Only Concise was a chemically cured system, the other systems wer...

background: the aim of the present study is to evaluate the effects of a fl uoride-releasing composite resin bonding material on reducing enamel demineralization underneath and around orthodontic brackets and compare that with a conventional adhesive system. materials and methods: buccal surfaces of 10 intact extracted premolar teeth were divided into two parts with nail varnish and stainless s...

Three-dimensional (3D) integration is an emerging technology that vertically stacks and interconnects multiple materials, technologies and functional components to form highly integrated micro/nano-systems. This paper reviews the materials and technologies for three wafer bonding approaches to 3D integration using adhesive, metal, and metal/adhesive as the bonding interfaces. Similarities and d...

High-energy-resolution fluorescence detection (HERFD) X-ray spectroscopy is presented as a new tool for the identification of the bonding sites of reactants in supported metal catalysts. The type of adsorption site of CO on an alumina-supported platinum catalyst and the orbitals involved in the bonding are identified. Because X-ray absorption spectroscopy (XAS) is element-specific and can be us...