Introduction Due to the goal of increasing functionality and decreasing costs in micro-electronic packages, integrated circuit processing and miniaturized fabrication technologies have been combined to result in microsystems such as System In Packages (SIP). Microsystems consist of multiple thin and stacked layers, manufactured using different materials. Hence, interfacial failures, mainly in t...

Stable ductile crack growth in 3 mm thick AISI 304 stainless steel specimens has been investigated experimentally and numerically. Multi-linear Isotropic Hardening method coupled with the Von-Mises yield criterion was adopted for modeling elasto-plastic behavior of the material. Mode-I CT fracture specimens have been tested to generate experimental load-displacement-crack growth data during sta...

Crack growth along an interface joining an elastic-plastic solid to a solid that does not yield plastically is studied numerically, accounting for mixed mode loading under conditions of small scale yielding. The fracture process is represented in terms of a cohesive zone model, for which the work of separation per unit area and the peak stress required for separation are basic parameters; but w...