نتایج جستجو برای: crack modeling

تعداد نتایج: 413100  

Hydraulic fracturing is a phenomenon in which cracks propagate through the porous medium due to high pore fluid pressure. Hydraulic fracturing appears in different engineering disciplines either as a destructive phenomenon or as a useful technique. Modeling of this phenomenon in isothermal condition requires analysis of soil deformation, crack and pore fluid pressure interactions. In this paper...

2016
G. Olson

Analysis of the dynamic evolution of multilevel structure during martensitic transformations provides kinetics-based constitutive relations for transformation plasticity. Application in numerical modeling of ductile fracture by microvoid-softening-induced shear localization, in conjunction with metallographic study of crack-tip processes, identifies transformation toughening mechanisms operatin...

2008
Pritam Ganguly Stephen A. Vavasis Katerina D. Papoulia

We propose a new two-dimensional meshing algorithm called PINW able to generate meshes that accurately approximate the distance between any two domain points by paths composed only of cell edges. This technique is based on an extension of pinwheel tilings proposed by Radin and Conway. We prove that the algorithm produces triangles of bounded aspect ratio. This kind of mesh would be useful in co...

Journal: :SIAM J. Scientific Computing 2004
Pritam Ganguly Stephen A. Vavasis Katerina D. Papoulia

We propose a new two-dimensional meshing algorithm called PINW able to generate meshes that accurately approximate the distance between any two domain points by paths composed only of cell edges. This technique is based on an extension of pinwheel tilings proposed by Radin and Conway. We prove that the algorithm produces triangles of bounded aspect ratio. This kind of mesh would be useful in co...

Journal: :polyolefins journal 2015
marzieh nouri mahmoud parvazinia hassan arabi mohsen najafi

a two-dimensional (2d) single particle model for the copolymerization of propylene-ethylene with heterogeneous ziegler-natta catalyst is developed. the model accounts for the effects of the initial shape of the catalyst and carck/ pore patterns on the copolymer composition, polymerization rate and the average molecular weight properties. the spherical and oblate ellipsoidal shapes of catalyst p...

2012
Ronald A. Roberts Cara A. Leckey R. A. Roberts A. C. Leckey

A computational study is performed to determine the contribution to ultrasound attenuation in carbon fiber reinforced polymer composite laminates of linear elastic scattering by matrix micro-cracking. Multiple scattering approximations are benchmarked against exact computational approaches. Results support linear scattering as the source of observed increased attenuation in the presence of micr...

2013
G. P. Nikishkov

Accuracy of the quarter-point and transition elements is investigated on oneand two-dimensional problems with inverse square-root singularity. It is demonstrated that most coefficients of the stiffness matrix of the quarter-point element are unbounded. However, numerical integration produces finite values of these coefficients. Influence of several parameters on the error in determining the str...

2011
Vipul Ranatunga

Finite element analysis of the delamination crack propagation in laminated composites is presented. Fracture mechanics based Virtual Crack Closure Technique (VCCT), and the cohesive element technique, have been used to simulate the delamination initiation and propagation under Mode-I type loading. Detailed description of the parameter selection process for these two techniques with ABAQUS®/Stan...

2004
Jianzheng Zuo Xiaomin Deng Michael A. Sutton

* Corresponding author; Email: [email protected] ABSTRACT Crack tunneling is a crack growth feature often seen in stable tearing crack growth tests on specimens made of ductile materials and containing through-thickness cracks with initially straight crack fronts. As a specimen is loaded monotonically, the mid-section of the crack front will advance first, which will be followed by crack growth ...

Journal: :Microelectronics Reliability 2016
Ah-Young Park Satish C. Chaparala Seungbae Park

Article history: Received 31 December 2015 Received in revised form 13 September 2016 Accepted 24 September 2016 Available online xxxx Through Silicon Via (TSV) technologywithmicro joint has been identified as the 3D package technology to overcome the limitations of I/O density and enhances the system performance compared to that of the conventional flip chip packages. One of the challenges of ...

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