A low-temperature process for mass-parallel self-assembly of three-dimensional micro-opto-electro-mechanical systems is described. The devices are fabricated by dry etching of bonded silicon-on-insulator wafers, and selfassembled by out-of plane rotation powered by a surface tension torque obtained by melting thick pads of photoresist. Fixed optical mirrors oriented at 45û and 90û to the substr...

Conventional capacitive MEMS transducer designs feature a single flexible diaphragm acting as a moving plate and an electrode patterned on the substrate acting as a stationary plate. Such devices generally function adequately as receivers. However, such devices show poor transmission efficiency when the gap dimension is limited by the manufacturing process and when the diaphragm would suffer “p...

This paper presents an investigation into the viability of a new route for the fabrication of titanium-based MEMS RF switches for harsh environment applications. Titanium’s intrinsic toughness and corrosion resistance suggest that it would be highly suitable for such applications and recently developed titanium micromachining technologies now make exploration of this potential possible. Two des...

Integrated optical switches using mechano-optical sensing are gaining more attention in many fields due to their fast switching speed, large bandwidth and compact devices. In this paper, a micromachined electrostatically actuated metal plate to sense the evanescent field above the waveguide is presented. The feasibility of MEMS based light weight mechanical plates to achieve fast switching is e...