Introduction: Nowadays, the main focus of dental studies is on adhesive dental materials; since clinical long-term success of bonded restorations depended more on marginal microleakage minimization. So, the aim of this study was Evaluation of Diode laser irradiation effect on microleakage in class V composite restoration before and after adhesive application. Materials and methods: In this in v...

objectives: this study aimed to evaluate the effects of saliva contamination on the metallic bracket microleakage bonded with two moisture-tolerant bonding systems. materials and methods:  ninety freshly extracted premolar teeth were randomly divided into six groups of 15 with the following treatments: g1 (control): after acid etching, assure primer and assure adhesive were applied to non-conta...

BACKGROUND Endodontic treatment, involves removal of the dental pulp and its replacement by a root canal filling. Restoration of root filled teeth can be challenging due to structural differences between vital and non-vital root filled teeth. Direct restoration involves placement of a restorative material e.g. amalgam or composite directly into the tooth. Indirect restorations consist of cast m...

This study was designed to evaluate effects of light-irradiated intensities directly and indirectly through resin composites to one- and two-step self-etch adhesives on dentin bonding. One-step (Clearfil S(3) Bond; TS, Bond Force; BF) or two-step (Clearfil SE Bond; SE) self-etch adhesives was applied to dentin surface. The adhesive agent was light-cured with light-intensity of 350 or 600 mW/cm(...

A simple, yet innovative, method is presented for fabricating high-aspect-ratio polymer nanohairs (aspect ratio >20) on a solid substrate by sequential application of molding and drawing of a thin polymer film. The polymer film was prepared by spin coating on a rigid or flexible substrate, and the temperature was raised above the polymer's glass transition while in conformal contact with a poly...

For microoptics and microsystem assembly, solder bumping is introduced as a flexible and high precise joining alternative to adhesive bonding, especially if adhesives limit the system performance in terms of long term, high temperature, vacuum or UV stability. The bumping technology, which is based on jetting the liquid solder onto wetting surfaces, can be parameter optimised to work in complex...

Background and Aim: One of the weaknesses of Class II composite resin restorations is gingival microleakage which contributes to postoperative sensitivity and secondary caries. The aim was to evaluate the microleakage in Class II composite resin restorations with different thicknesses of resin-modified glass ionomer (RMGI). Materials and Methods: In this in-vitro study, standardized Class II s...

In this paper, considering an adhesively bonded composite single-lap joint, a novel approach is presented to predict the peel and shear stress distributions of the adhesive layer for an ASTM standard test sample. In current method, the equilibrium equations are derived using the energy method and based on the Timoshenko’s beam theory. Two solution procedures then are discussed, one of which rep...