نتایج جستجو برای: hyrogen bonding
تعداد نتایج: 43815 فیلتر نتایج به سال:
This study examined the relationships among school bonding, identity styles, and family climate with mediation of self-compassion. This research had a descriptive-correlational design. The statistical population of the study comprised all senior high school students in Kangavar in 2020-21 school year from among whom 520 students were selected through multi-stage cluster sampling method. The res...
Eating disorders are among growing chronic mental illnesses around the world. Bulimia nervosa is a subtype of eating disorder, whereby a person fluctuates between extreme diet and overeating. The study made an attempt to compare the effectiveness of schema therapy and cognitive-behavioral therapy on eating disorder symptoms in patients with bulimia nervosa considering parental bonding. The stud...
The aim of the present study was to investigate the role of secure bonding, relationship care, and work-family balance in predicting the marital disaffection of married teachers during the Covid-19 quarantine period. The present research method is a correlational description. The statistical population included all the teachers of Semnan province in 1400, whose number was reported to be 8370. 3...
We have carried out extensive computational analyses of the structure and bonding mechanism in trihalides DX⋅⋅⋅A(-) and the analogous hydrogen-bonded complexes DH⋅⋅⋅A(-) (D, X, A=F, Cl, Br, I) using relativistic density functional theory (DFT) at zeroth-order regular approximation ZORA-BP86/TZ2P. One purpose was to obtain a set of consistent data from which reliable trends in structure and stab...
Control of intermolecular interactions is integral to harnessing self-assembly in nature. Here we demonstrate that control of the competition between hydrogen bonds and halogen bonds, the two most highly studied directional intermolecular interactions, can be exerted by choice of solvent (polarity) to direct the self-assembly of co-crystals. Competitive co-crystal formation has been investigate...
Chip on board wire bonding presents challenges to modern wire bonding technology which include smaller, closely spaced wire bond pads; bonding to soft substrates without special processing and pad construction; and diverse first bond and second bond metallurgies. These challenges are addressed by extensive bonding accuracy tests, a design of experiments approach for optimizing wire bond process...
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