An inadequate fit at the abutment/implant interface can generate mechanical and biological problems. The laboratorial stages could induce misfit in such interface when the castable UCLA abutment type is used. The purpose of this study was to comparatively evaluate the performance of three prosthetic laboratories (Labs A, B and C) by vertical fit analysis of castable UCLA abutments on the castin...

This study discusses the automated visual inspection of electronic boards used in mass production power electronics equipment. Soldering splashes, produced during necessary manufacturing stages, can affect hybrid semiconductor modules' quality, specifications and lifespan. Splashes from soldering may appear some areas when they cause decreasing quality these need to be removed. Image analysis a...

We demonstrated soldering of an electrical component (the metal-oxide semiconductor field effect transistor (MOSFET)) on a printed circuit bord (PCB) via solder paste heated by microwave irradiation. The behavior the object soldered with in magnetic and electric were evaluated using various resonators. In field, was selectively confirmed that MOSFET connected onto PCB without any damage operate...

In new high definition lighting modules, assembling more than thousand elements (pixels) with a single mm-sized motherboard is achieved by reflow soldering. Lead-free solders may constitute weak part of electronic components and LED assemblies. During reflow, the distance between pixels controls solder heights (10 μm). After assembly, all are in plane. To ensure constant heights, this plane has...

We report design and test results of a new thermal contact method for PrNi $$_5$$ rod, nuclear coolant compact continuous demagnetization refrigerator (CNDR) which can keep temperature below 1 mK continuously, using Zn soldering rather than Cd soldering. By measuring residual electrical resistance short piece, the resistivity between rod an Ag wires link was estimated as $$1.8\pm 0.1 \times 10^...