Formation of C–C, C–N, and C–H bonds using three heterogeneous catalysts in the form of nickel-in-charcoal (Ni/C), nickel-on-graphite (Ni/Cg), and copper-in-charcoal (Cu/C) are described.

In the title solvated complex, [NiCl(2)(C(31)H(27)NP(2))]·CH(2)Cl(2), the Ni(2+) ion is coordinated by two chloride ions and two P atoms of the chelating N,N-bis-(diphenyl-phosphan-yl)benzyl ligand to generate a strongly distorted cis-NiCl(2)P(2) square-planar geometry for the metal ion. In the crystal, the components are linked by C-H⋯Cl inter-actions.

Fe-Ni alloys of meteoritic composition were solidified by a plane front solidification technique. Distribution coefficients of Ni, P, Ir, Ge, and Cu were determined from the composition data of the plane front solidified alloys. Equations that describe the distribution coefficients (P, Ni, Ir, Ge, and Cu) as a function of S and P content as well as S to P ratio were used to calculate solute par...

The title complex, [Ni(C(12)H(8)N(2))(2)(H(2)O)(2)][Ni(CN)(4)]·C(4)H(8)O·H(2)O, consists of a cationic [Ni(C(12)H(8)N(2))(2)(H(2)O)(2)](2+) unit, an anionic [Ni(CN)(4)](2-) unit, one uncoordinated water and one tetra-hydro-furan mol-ecule. In the cationic unit, the Ni(2+) atom is coordinated by four N atoms and two O atoms from two 1,10-phenanthroline ligands and two water mol-ecules in a disto...

The title compound, [Ni(C(12)H(9)O)Cl(C(18)H(15)P)(2)]·CH(2)Cl(2), was synthesized from the reaction between 1-acetyl-4-chloro-naphthalene, NiCl(2)·6H(2)O and triphenyl-phosphine (PPh(3)) in ethanol. The compound contains one crystallographically unique nickel ion in a pseudo-square-planar geometry.

BACKGROUND The most favorable feature of nickel-titanium (Ni-Ti) alloys in orthodontics is producing constant forces in a wide deformation range. Ni-Ti closed coils produce compressive strength and can be used for several purposes such as space closure. The aim of this study was to evaluate the effects of the aging process (temperature changes and prolonged strain) on Ni-Ti closed coils and to ...

Ni-based under-bump metallization (UBM) has attracted wide attention due to its low reaction rate with Sn, compared with Cu and Cu alloy. In this study, the interfacial reactions between eutectic Sn–3.5Ag solder and Ni-based UBM, including electroplated Ni (EP-Ni) and electroless Ni (EL-Ni) are investigated. Morphology and growth kinetics of Ni3Sn4 intermetallic compounds are studied at differe...

The formation of the crystal structure of the NiMoO4 high temperature phase in the solid phase reaction NiO+u-M003+fiNiMo04at 600 C has been "in dtu" studied with the high temperature synchrotron technique. We have performed the measurements of the Extended X-ray Absorption Fine Structure (EXAFS) and the X-ray Absorption Near Edge Structure (XANES) at the Kedge of Ni atom in during the P-NiMo04...