We have studied the magnetic reversal and thermal stability of [Co(0.3 nm)/Pd(0.7 nm)]N multilayers patterned into 35-nm-diameter nanodot arrays. The short-time coercive fields are relatively constant with N while the room-temperature thermal stability parameter increases nearly linearly with N. However the magnetic switching volume extracted from the thermal stability is significantly less tha...

Two of the major concerns in 3D stacked technology are heat removal and power density distribution. In our work, we propose a novel 3D thermal-aware floorplanner. Our contributions include: 1. A novel multi-objective formulation to consider the thermal and performance constraints in the optimization approach. 2. Two efficient Multi-Objective Evolutionary Algorithm (MOEA) for the representation ...

Interfacial thermal transport between offset parallel (10,10) single-wall carbon nanotubes is investigated by molecular dynamics simulation and analytical thermal modeling as a function of nanotube spacing, overlap, and length. A four order of magnitude reduction in interfacial thermal resistance is found as the nanotubes are brought into intimate contact. A reduction is also found for longer n...

The detection of thermal insulation failures in buildings in operation responds to the challenge of improving building energy efficiency. This multidisciplinary study presents a novel four-step soft computing knowledge identification model called IKBIS to perform thermal insulation failure detection. It proposes the use of Exploratory Projection Pursuit methods to study the relation between inp...

A clustering method is an effective way to select the proper temperature sensor location for thermal error modeling of machine tools. In this paper, a new temperature sensor clustering method is proposed. By analyzing the characteristics of the temperature of the sensors in a heavy floor-type milling machine tool, an indicator involving both the Euclidean distance and the correlation coefficien...

A hybrid method, applied thermal modeling and temperature measurement, is proposed to estimate the junction temperature (Tj) of high-power light-emitting diodes (LEDs) at system level, and further project long term lumen maintenance of LED lamps. First, 3D finite element modeling on commercial LED lamps is performed based on lamp structure and material information to find a steady and reliable ...

Gallium nitride (GaN) high-electron-mobility transistors (HEMTs) dissipate high power densities which generate hotspots and cause thermomechanical problems. Here, we propose and simulate GaN-based HEMT technologies that can remove power densities exceeding 30 kW/cm at relatively low mass flow rate and pressure drop. Thermal performance of the microcooler module is investigated by modeling both ...

A 3D Finite Element Method (FEM) model for directional removing of a tumor is presented in this paper. The proposed model shows a new method to control the direction of the temperature diffusion during the thermal ablation. We developed a directional probe with a curved cathode as heating source to remove the malignant cells and protect the surrounding healthy cells. With the use of the COMSOL ...

 In this research, a numerical modeling was utilized to calculate the stresses caused during thermal cycling in a functionally graded thermal barrier coating (FG - TBC). The temperature – dependent material response of this protective material was taken into account and the effects of thermal cycle and interface morphology of the ceramic / metallic layer in functionally graded coating system wa...