Solutions of the stress field due to the eigenstrain of an ellipsoidal inclusion in the film/ substrate half-space are obtained via the Fourier transforms and Stroh eigenrelation equations. Based on the acquired solutions, the effect of a thin film’s thickness on the stress field is investigated with two types of ellipsoidal inclusions considered. The results in this paper show that if the thic...

We have utilized a transmission ratio (TR) between curtain-shaped (Curtain) Mura and non-Mura zones as a key parameter to characterize the optical appearance of Curtain Mura occurred on a 13.3-in TFT–TN panel (Mura sample) after bonding process to place silicon-based driver-IC chips on one of the panel substrates using anisotropic conductive film as a binder (COG ACF process). Our measured TRs ...

Solutions are presented for the elastic plane-strain problem of a crack in a coating on a compliant substrate of finite thickness. Analysis of the problem shows that substrate thickness has a significant effect on the steady-state energy release rate for channel cracks. This is so over a wide range of elastic mismatch between film and substrate, but is especially important if the substrate is m...