This paper addresses one of the most promising technologies that meets the demand in terms of miniaturization and increased performance. IPDiA has developed a range of silicon interposers which, when combined with Integrated Passive Devices (IPD) and Through Silicon Vias (TSV), offer a new solution to related portable products, implantable medical devices, avionics and defense.

SHRIMP AQUACULTURE HAS BEEN DRAMATICALLY AFFECTED BY MANY PATHOGENIC DISEASES, MAINLY CAUSED BY FIVE VIRUSES: IHHNV, YHV, TSV, WSSV, and IMNV. Here we provide a state-of-the-art overview of these shrimp viruses, with emphasis on distribution, pathology, morphology, and genomic organization, in addition to current diagnostic methods and intervention practices.

This paper reviews the major adhesives and processes used for 3D TSV thin wafer handling, provides thermal and other performance data on the materials and processes and attempts to establish a first order estimate of process related thermal performance using a common analytical method.

Context Mortality of new-born lambs is well known to have important implications for both animal production and welfare. Improving survival rates by genetic selection very desirable, but the low heritability traits challenges prospect useful gain. Aim This study aimed derive environmental parameters lamb in Elsenburg Merino resource flock. It also investigated correlations possible indicator bi...

AIMS Behçet's disease (BD), a multisystemic inflammatory disorder, has been associated with a number of cardiovascular dysfunctions, including endomyocardial fibrosis of the right heart, atrial fibrillation, ventricular arrhythmias and sudden cardiac death. The incidence and nature of cardiac involvement in BD are not yet clearly documented. Our aim was to evaluate left atrial (LA) volume and f...

Article history: Received 25 April 2016 Received in revised form 26 June 2016 Accepted 29 July 2016 Available online 10 August 2016 The purpose of this paper is to analyze and predict the thermal deformation of the through silicon via (TSV) interposer package during themanufacturing process and to perform a parametric study to minimize thewarpage and thermal stress. Samples were selected during...

We report here the complete genome sequence of an emerging genotype of tobacco streak virus (TSV) infecting zucchini squash in Florida (TSV_FL13-07), obtained using deep sequencing of short RNAs (sRNAs) and validation by Sanger sequencing. TSV_FL13-07 shares only <90% sequence identity in all three genomic RNAs to several known U.S. isolates.