Several candidate alloys have been suggested as high-temperature lead-free solder for Si die attachment by different researchers. Among them, Zn–Al based alloys have proper melting range and excellent thermal/electrical properties. In this study, Zn–Al–Mg–Ga solder wire was used to attach Ti/Ni/Ag metallized Si die on Cu lead-frame in an automatic die attach machine. Die attachment was performe...

Steam reforming of methanol can be considered as an attractive reaction aiming at hydrogen production for PEM fuel cells. Although Cu/Al-contained catalysts are considerably evaluated in this reaction, further evaluation is essential to evaluate the impact of some promoters like Pt in order to find a comprehensively optimized catalyst. Pt promoter is employed with different methods in this ...

Nano-sized ceramic particle reinforced aluminum composites exhibit excellent room-temperature mechanical properties. However, there is limited research on the dry sliding wear behavior of those composites at elevated temperatures, which should be one of the major concerns on elevated temperature applications. Here the Al-Cu composites reinforced with nano-sized TiCp were fabricated. The dry sli...

Single pan thermal analyses (SPTA) have been performed on Cu–14.5 wt.% Sn, Cu–21.3 wt.% Sn and Cu–26.8 wt.% Sn peritectic alloys. For this purpose, a SPTA assembly has been built and calibrated. As the latent heat is a function of temperature and composition during solidification of alloys, a new heat flow model coupled to a Cu–Sn thermodynamic database has been defined for the calculation of t...