PURPOSE Electrical potential may facilitate the moving of corroded metal ions across radicular dentin to cause allergic reaction. This study was to investigate the effect of electrical potentials on the penetration of silver and copper ions through radicular dentin. MATERIALS AND METHODS Eighty-eight dentin discs were prepared from intact premolar teeth and placed between two containers of th...

Silver acetylides and organic azides react under copper(I) catalysis to afford 1,4-disubstituted 1,2,3-triazoles. Mechanistic studies implicate a process involving transmetallation to copper acetylides prior to cycloaddition. This work demonstrates that silver acetylides serve as suitable precursors for entry into copper-mediated coupling reactions. This methodology allows the incorporation of ...

This study evaluates the effects of different additives such as silver ion, medium and energy sources on the efficiency of mixed moderate thermophilic bioleaching approach to extract Cu, Mo and Re from molybdenite concentrate containing 0.98% Cu, 1.56% Fe, 53.84% Mo, and 0.055% Re. Molybdenite was the major phase of Mo-bearing mineral and chalcopyrite, covellite and pyrite were distinguished as...

Tetrathiomolybdate (TTM) avidly interacts with copper and has recently been employed to reduce excess copper in patients with Wilson disease. We found that TTM inhibits the purified Enterococcus hirae CopB copper ATPase with an IC(50) of 34 nM. Dithiomolybdate and trithiomolybdate, which commonly contaminate TTM, inhibited the copper ATPases with similar potency. Inhibition could be reversed by...

Metallic bonding at an interface is determined by the application of heat and/or pressure. The means by which these are applied are the most critical for joining nanoscale structures. The present study considers the feasibility of room-temperature pressureless joining of copper wires using water-based silver nanowire paste. A novel mechanism of self-generated local heating within the silver nan...

A novel spectrophotometric flow injection method for determination of silver(I) in a strongly acidic solution containing concentrated copper(II) was developed using a coloring ligand, 4-(3,5-dibromo-2-pyridylazo)-N-ethyl-N-(3-sulfopropyl)aniline (3,5-diBr-PAESA). The method was first investigated by batch method. The interference from copper(II) chelate could be eliminated by the masking effect...

The method of fabricating metallic nanowires from directionally solidified eutectics was applied to the silver–copper system. The silver–copper lloy, 39.9 at.% copper, was directionally solidified in a Bridgman-type oven held at 850 ◦C. SEM imaging revealed a mixed fibrous and lamellar icrostructure. The fastest solidification rates produced fibres and lamellae with widths as small as 300 nm. E...

As the electronics industry begins to focus upon the tin-silver-copper family of alloys as a viable replacement for tin-lead solders, research needs to be done to determine if any particular alloy is best suited for the broadest range of applications. The tin-silver-copper family of alloys has earned a great deal of positive response from various industry consortia and organizations in recent y...

The present work was focused on obtaining biocide coatings constituted by a glassy soda-lime matrix containing silver or copper nanoparticles on ceramic (alumina and zirconia based) substrates. Both glassy coatings showed a high biocide activity against Gram-, Gram+ bacteria and yeast, reducing cell numbers more than three logarithms. Silver nanoparticles had a significantly higher biocide acti...

Copper-silver (Cu-Ag) ionization has effectively controlled Legionella spp. in the hot water systems of numerous hospitals. However, it was ineffective at controlling Legionella in one Ohio hospital despite the confirmation of adequate total concentrations of copper and silver ions. The pH of the water at this hospital was found to be 8.5 to 9.0. The purpose of this study was to investigate the...