Using a DFT-based genetic algorithm (GA) approach, we have determined the most stable structure and stoichiometry of a 309-atom icosahedral AuCu nanoalloy, for potential use as an electrocatalyst for CO2 reduction. The identified core-shell nano-particle consists of a copper core interspersed with gold atoms having only copper neighbors and a gold surface with a few copper atoms in the terraces...

Standard enthalpies of formation of ternary phases in the Cu-Ni-Sn system were determined along sections at 25, 41 and 45.5 at.% Sn applying tin solution drop calorimetry. Generally, the interaction of Ni with Sn is much stronger than that of Cu with Sn. Along all sections the enthalpy of formation changes almost linearly with the mutual substitution of Cu and Ni within the respective homogenei...

The application of Cu-filled through-silicon via (TSV) in 3-D integrated circuit packaging faces several fabrication and reliability issues. In this study, we introduced a Cu-Ni alloy for TSV filling with a high filling speed and a reduced TSV protrusion. In particular, the characteristics of Cu-Ni via protrusions at various annealing temperatures (3200­450°C) were investigated with experimenta...

The long-lived isotopes of nickel (Ni, Ni) have current and potential use in a number of applications including cosmic radiation studies, biomedical tracing, characterization of low-level radioactive wastes, and neutron dosimetry. Methods are being developed at LLNL for the routine detection of these isotopes by AMS. One intended application is in Hiroshima dosimetry. The reaction Cu(n,p)Ni has...

Electromigration in the Ni/Sn-Zn/Cu solder interconnect was studied with an average current density of 3.51 9 10 A/cm for 168.5 h at 150 C. When the electrons flowed from the Ni side to the Cu side, uniform layers of Ni5Zn21 and Cu5Zn8 were formed at the Ni/Sn-Zn and Cu/Sn-Zn interfaces. However, upon reversing the current direction, where electron flow was from the Cu side to the Ni side, a th...

X-band electron spin resonance (ESR) and electronic spectra of oxalatobridged heterodinuclear Cu-Ni and Cu-Zn complexes, viz., [(PMDT)Cu-Ox-Ni(PMDT)](BPh(4))(2).2CH(3)CN and [(PMDT)Cu-Ox-Zn(PMDT)](BPh(4))(2).2CH(3)CN, where PMDT=pentamethyldiethylenetriamine, Ox=oxalate ion have been described. Complex [(PMDT)Cu-Ox-Ni(PMDT)](BPh(4))(2).2CH(3)CN has been structurally characterized. This complex ...

in this research a layer of ni-cu-p was deposited on 304 stainless steels by using gelatin and thiourea asadditives in a sulfate solution. in order to determine the properties of deposited layers, a microhardness testerwas used for microhardness measurement, x.r.d. for microstructural analysis, and a scanning electronmicroscope equipped with e.d.x. for determining morphology and analyzing the d...

The composition dependence of the emission intensities was investigated in Cu-Ni as well as Ni-Zn binary alloy samples when a low-pressure argon laser-induced plasma was employed as the excitation source. The calibration curve in the Cu-Ni alloy system gave a linear relationship, implying that the selective evaporation of Cu or Ni atoms was caused less in those alloys having several chemical co...

Scanning tunneling microscopy studies of Ni islands deposited on TiO2(1 1 0) show that the islands grow threedimensionally at room temperature with an average height of approximately 6.5 A and diameter of 30 A. The broadness of the island size distributions can be controlled by the diffusion (D) to deposition flux (F ) ratio, with the narrowest distribution corresponding to the smallest D=F rat...