Grain boundary networks should play a dominant role in determining the mechanical properties of nanocrystalline metals. However, these networks are difficult to characterize and their response to deformation is incompletely understood. In this work, we study the grain boundary network of nanocrystalline Ni and explore whether it can be modified by plastic deformation. Mechanical cycling at room...

Advancements in technology enable integration of multiple devices on a single core, resulting in increased on chip power and temperature densities. Higher temperatures, in turn, present a significant challenge for reliability. In this work we propose a comprehensive framework for analyzing reliability of multi-core systems, considering permanent faults. We show that aggressive power management ...

We report on the shape memory characteristics and magnetic behavior of polycrystalline and single crystalline FeNiCoTi. Predeforming the samples in the martensitic state and biasing of the martensite variants produced anisotropy in the magnetization behavior allowing the ‘easy axis’ to be identified as the ‘a-axis’ in the martensitic state. Based on these results, we provide an estimate of the ...

Models that characterize the displacement instability of the thermally grown oxide (TGO) found in some thermal barrier systems are reviewed, consolidated and extended. It is demonstrated that the simulations are only consistent with the observations whenever the bond coat and TGO both undergo plastic deformation. The TGO yields at the peak temperature, during growth, while the bond coat yields ...

This paper discusses the commonly accepted method for life-time prediction for power converters in traction. The method is based on junction temperature estimation and thermal cycles on a given duty cycle. The predicted numbers of thermal cycles are compared to the curves giving the number of cycles to failure versus temperature cycles. These curves are extrapolated from power cycling tests. Po...

– Stimulated by recent experimental results, we simulate " temperature "-cycling experiments in a model for the compaction of granular media. We report on the existence of two types of memory effects: short-term dependence on the history of the sample, and long-term memory for highly compact (aged) systems. A natural interpretation of these results is provided by the analysis of the density het...

Life time of electronic products is often limited by competing failure mechanisms brought on by the product’s use and its surrounding environment. Solder interconnect failure is a known life limiting failure mechanism that is induced by repeated temperature excursions. Thermal fatigue reliability of solder is conventionally assessed by simple temperature cycling tests, which apply a constant te...

In a modern three-dimensional integrated circuit (3D IC), vertically stacked dies are interconnected using through silicon vias. 3D ICs are subject to undesirable temperature-cycling phenomena such as through silicon via protrusion as well as void formation and growth. These cycling effects that occur during early life result in opens, resistive opens, and stress induced carrier mobility reduct...

0026-2714/$ see front matter 2012 Elsevier Ltd. A http://dx.doi.org/10.1016/j.microrel.2012.03.026 ⇑ Corresponding author. E-mail address: [email protected] (W Embedding passive components into multilayer printed wiring boards (PWBs) meet electronic device requirements concerning the necessity of saving the surface board area for active elements, reducing board’s size, improving de...

Dynamic magnetic properties of Y0.7Ca0.3MnO3 are reported. The system appears to attain local ferromagnetic order at TSRF ≈ 70 K. Below this temperature the low field magnetization becomes history dependent, i.e. the zero field cooled (ZFC) and field cooled (FC) magnetization deviate from each other and closely logarithmic relaxation appears at our experimental time scales (0.3-104 sec). The ze...