نتایج جستجو برای: ductile grinding

تعداد نتایج: 13303  

2016
Z. W. Zhong

This article studies the effect of grinding along crystallographic directions on the surface finish of single-crystal silicon. It also discusses new and=or improved processes for precision machining brittle materials, including silicon. Silicon samples were cut from (100) silicon wafers. These samples were then subjected to grinding along different crystallographic directions under the same exp...

Journal: :Journal of the Japan Society for Precision Engineering 1990

2017
Abhijit Chandra Ashraf F. Bastawros

The material detachment mechanisms of ductile metal surfaces are studied experimentally during dry grinding operation in a simulated experiment with near single grit contact with the surface. The spectra of the cutting and thrust forces are recorded and analyzed. It is found that the thrust force changes its direction from a compressive to a tensile mode. The ratio between the thrust and cuttin...

2003
L. C. Zhang

Industrial Summary : The application of modern materials in severe working environment requires that the surface integrity of ground elements should reach a high level to obtain satisfactory resistance to various external stimuli. In response, extensive attention has been paid to study this key factor such that the working reliability of ground components could be improved to the full extent. T...

Journal: :CIRP Annals 2022

During uneven and time-dependent compliant grinding of brittle materials, the surface topography is difficult to predict as ductile regions are coupled due compliance occurring in macro/micro tool-workpiece contact. This paper proposed a predictive model for prediction by considering its ductile-brittle transition grinding. Shape adaptive monocrystalline silicon were chosen an example validate ...

2007
Jiwang Yan John Patten John A. Patten Jerry Jacob Biswarup Bhattacharya Andrew Grevstad Ning Fang Eric R. Marsh

This chapter presents numerical simulation work and single-point nano-machining experiments conducted on semiconductor and ceramic materials, e.g. silicon (Si) and silicon carbide (SiC). The apparent ductile mode material removal mechanism observed in these materials is believed to be the result of a high pressure phase transformation (HPPT), which generates a small Correspondence/Reprint reque...

2012
Zong-Bo Xie Na Wang Ming-Yu Wu Ting He Zhang-Gao Le Xiao-Qi Yu

An environmentally benign, fast and convenient protocol has been developed for the Michael addition of 1,3-dicarbonyl compounds to β-nitroalkenes in good to excellent yields by a grinding method under catalyst- and solvent-free conditions.

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