An ultrasound-assisted activation method for electroless silver plating is presented in this study. When the ultrasound was applied during the activation step, the amount of the Pd species adsorbed on substrate surfaces was higher than that of sample pretreated with a conventional activation process without ultrasound irradiation. With this activation method, it was also shown that the adsorbed...

The use of magnesium alloys is limited due to their susceptibility to corrosion although they have many attractive physical and mechanical properties. To increase mechanical and corrosion properties of these alloys, many deposition method and coating types are used. Electroless Ni–B coatings have received considerable interest recently due to its unique properties such as cost-effectiveness, th...

For solder based flip-chip assembly, the deposition of an under bump metallisation (UBM) layer onto the surface of the AI bondpads of the die is the first step in the wafer bumping process. The UBM is necessary, as the fragile AI pad has a tenacious oxide layer that cannot be soldered without the use of strong fluxes and a barrier layer is required to prevent dissolution of the bondpad into the...

The influence of pretreatment of AAO template and deposition process on magnetic NiCoFe nanowire fabricated by electroless method was investigated. The Electroless process carried out at room temperature using DMAB as a reductant agent. SEM and EDX analysis used to characterize the deposited sample. According to the results, sonication during deposition process is not recommended in fabrication...

The influence of the nucleation process of Ag particles on the formation of Si nanowire arrays is investigated by two-stage electroless chemical etching. The dimensions of the Ag particles formed in the first stage of the process play an important role in the formation of the Si nanowires. The nucleation and etch result are analysed using SEM. The electrical properties of the resulting Si NW ar...

The growth kinetics of intermetallic compound layers formed between eutectic Sn–58Bi solder and (Cu, electroless Ni–P/Cu) substrate were investigated at temperature between 70 and 120◦C for 1 to 60 days. The layer growth of intermetallic compound in the couple of the Sn–58Bi/Cu and Sn–58Bi/electroless Ni–P system satisfied the parabolic law at given temperature range. As a whole, because the va...

Two coatings have been developed for petrochemical compressor antifouling and corrosion resistance purposes. One is a multilayer composite coating with a modified polytetrafluoroethylene (PTFE) impregnated organic topcoat, which gives it superior antifouling performance to the similar coating that has been used by the compressor original equipment manufacturers (OEMs). The other is a high-phosp...

As the laminate substrate industry moves from Hot Air Solder Level (HASL) finishes, alternate plating finishes are being proposed such as immersion gold/electroless nickel, electroless palladium and electroless silver. This paper presents results of an evaluation of the thermosonic gold ball wire bondability of electroless palladium. Two palladium thicknesses, with and without a nickel underlay...

Ni-P and Ni layers multilayer coatings were applied to AZ31 magnesium alloy utilizing electroless and electrodeposition procedures. The aim of the project was to decrease cracks and increase corrosion resistance of the coatings. In order to compare the coatings, the effect of single layer electroless Ni-P coatings with different thicknesses was also investigated. The microstructure and phase co...

The formation of Au microbump arrays for flip-chip bonding was investigated using an electroless Au plating bath. Generally, electroless Au deposition gives a low deposition rate, preventing the fabrication of Au bumps with heights of more than 5 μm. To overcome this problem, we developed a new electroless Au deposition process that employs a non-cyanide bath. This process delivers a high depos...