نتایج جستجو برای: electroless deposition

تعداد نتایج: 94089  

Journal: :Journal of the American Chemical Society 2005
Liangti Qu Liming Dai

By simply supporting carbon nanotubes with a metal substrate of a redox potential lower than that of the metal ions to be reduced into nanoparticles, we have developed a facile yet versatile and effective substrate-enhanced electroless deposition (SEED) method for functionalizing nanotubes with a large variety of metal nanoparticles, including those otherwise impossible by more conventional ele...

1997
I. I. SUNI

The importance of microscopic morphological control to metal electroand electroless deposition in several emerging technologies is discussed. The use of in situ optical probes of the morphological development of deposits is described. A number of these are reviewed to describe both the potential of each method and the available literature on studies of electroand electroless deposition. Include...

2015

The use of magnesium alloys is limited due to their susceptibility to corrosion although they have many attractive physical and mechanical properties. To increase mechanical and corrosion properties of these alloys, many deposition method and coating types are used. Electroless Ni–B coatings have received considerable interest recently due to its unique properties such as cost-effectiveness, th...

2014
Gilles Scheen Margherita Bassu Antoine Douchamps Chao Zhang Marc Debliquy Laurent A Francis

We present an original two-step method for the deposition via precipitation of Pd nanoparticles into macroporous silicon. The method consists in immersing a macroporous silicon sample in a PdCl2/DMSO solution and then in annealing the sample at a high temperature. The impact of composition and concentration of the solution and annealing time on the nanoparticle characteristics is investigated. ...

2013
Benjamin S. Cook Yunnan Fang Sangkil Kim Taoran Le Brandon Goodwin Kenneth H. Sandhage Manos M. Tentzeris

A scalable, low-cost process for fabricating copper-based microwave components on flexible, paper-based substrates is demonstrated. An inkjet printer is used to deposit a catalyst-bearing solution (tailored for such printing) in a desired pattern on commercially-available, recyclable, non-toxic (Teslin®) paper. The catalystbearing paper is then immersed in an aqueous copper-bearing solution to ...

Journal: :Nanoscale 2015
Jeong Hoon Byeon Dongho Park Jeong Yeol Kim

Site-selective deposition of aerosol Pd nanoparticles on a substrate was employed to fabricate nanoscale Ag dots and rings through a subsequent electroless deposition. The fabricated nanoscale dot and ring arrays respectively showed properties in surface-enhanced Raman (SER, with a 1.8 × 10(5) enhancement factor) and Fourier transform near infrared (FT-NIR, at 6153 cm(-1) absorption band) spectra.

2012
T. V. Gaevskayà L. I. Stepanova T. N. Vorobyova

Journal: :ACS applied materials & interfaces 2010
Yu-Fen Tzeng Hung-Chi Wu Pei-Sun Sheng Nyan-Hwa Tai Hsin Tien Chiu Chi Young Lee I-Nan Lin

This work describes newly structured stacked silicon nanowires (s-SiNWs), consisting of nanosized silicon wires on top of silicon microrods (SiMRs) and exhibiting pronouncedly superior electron field emission (EFE) characteristics to the conventional SiNWs, by using a two-step electroless metal deposition process. Experimental results indicate that for these s-SiNWs, the electrostatic "screen e...

Journal: :Physical chemistry chemical physics : PCCP 2016
Abhishek Lahiri Mark Olschewski René Gustus Natalia Borisenko Frank Endres

Sodium-ion batteries (SIBs) are emerging as potential stationary energy storage devices due to the abundance and low cost of sodium. A simple and energy efficient strategy to develop electrodes for SIBs with a high charge/discharge rate is highly desirable. Here we demonstrate that by surface modification of Ge, using electroless deposition in SbCl3/ionic liquids, the stability and performance ...

2012
Ryohei Arima Fumihiro Inoue Hiroshi Miyake Tomohiro Shimizu

Cu-filled TSV (through silicon via) is important technology for 3-D LSIs in order to obtain higher packing density, faster signal transmission, and lower power consumption. Diameter of TSV is expected to be smaller than 2 μm, and its aspect ratio to be larger than 10 in near future [1]. For realizing a high aspect ratio Cu-filled TSV, it is essentially important to form the barrier and seed lay...

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