Curry leaf, also known as Murraya koenigii Sprenge, is a member of the Rutaceae family and an aromatic spice. In South India, leaves are primarily used for culinary purpose. An investigation was conducted to find best packing material curry leaf in order extend their shelf life maintain high-quality standards. present experiment, ply cardboard boxes with ventilation, sleeves various gauges, jut...

With the development of power modules for high voltage, temperature, and density, their size is becoming smaller, packaging insulation experiences higher electrical, thermal, mechanical stress. Packaging needs to meet requirement that internal electric field, stress should be as low possible. Focusing on coupling principles optimization design among stresses in module insulation, a multi-object...

Exceeding component maximum ratings due to transient events like current spikes can lead to premature failure of surface mount resistors due to thermal and electrical overstress. In order to accurately evaluate device parameters and their impact on the circuit behavior a coupled electro-thermal simulation method must be applied under the influence of packaging. This article presents an analysis...

This paper is aimed at identifying the potential role of SPICE, especially SPICE level 3, to achieving the proposed UK public sector efficiencies. SPICE level 3 presents the process maturity framework to address the level III of the SPICE model. Building upon the developments of level II, SPICE 3 advocates establishment of a process improvement infrastructure to facilitate good practice sharing...

This paper describes the latest iteration of the SPICE research. SPICE 3 explains the process maturity framework to address the level III of the SPICE model. Building upon the developments of level II, SPICE 3 advocates establishment of a process improvement infrastructure to facilitate good practice sharing in construction organisations. To achieve SPICE level III process maturity, organisatio...