Design, simulation, and implementation of low profile microstrip spiral inductors for high power Industrial, Scientific and Medical (ISM) applications at the high frequency (HF-3–30 MHz) range are given for the first time. An accurate analytical model and algorithm have been developed to determine the simplified lumped element equivalent model parameters for spiral inductor and its physical dim...

There has been a tremendous research effort in recent years to move DC-DC converters on chip for enhanced performance. However, a major limiting factor to implement on-chip inductive DC-DC converters is the large area overhead induced by spiral inductors. Towards this, we propose to use through-silicon-vias (TSVs), a critical enabling technique in three-dimensional (3D) integrated systems, to i...

This section explains overview of the on-chip inductors. Demand for on-chip inductors has been increasing especially for CMOS RF circuits. An on-chip inductor is a key component because its performance directly affects the circuit performance and the chip cost. The onchip inductors have been used, for example, as a matching network component, as baluns, and as an inductive load. The requirement...

A micro-fabrication process is proposed to realize high-thickness spiral inductors for the remote powering of implantable biosensors through inductive link. The process is suitable for different substrates, such as silicon and Pyrex, and enables the fabrication of the receiving inductor directly on the implantable system. The use of Ordyl Alpha960 is explored to achieve high-thickness structure...

Inductors are essential components of radio frequency integrated circuits (RFICs). While the active devices in RF systems downscale steadily, inductors have not been able to keep up with the pace of continual miniaturization because of the trade-off between size and performance as well as fabrication complexity. Strain-induced self-rolled-up nanotechnology allows the formation of three-dimensio...

Wireless power transfer via inductive link is becoming a popular choice as an alternate powering scheme for biomedical sensor electronics. Spiral printed circuit board (PCB) inductors are gaining attractions for wireless power transfer applications due to their various advantages over conventional inductors such as low-cost, batch fabrication, durability, manufacturability on flexible substrate...

Monolithic on-chip inductors are key passive devices in radio frequency integrated circuits (RFICs). Currently, 70-80% of the on-wafer area of most RFIC chips is occupied by the sprawling planar spiral inductors, and its operation frequency is limited to a few GHz. With continuous scaling of the transistor technology, miniaturization and high frequency operation of inductors have become the bot...

In this paper, a closed-form integral representation for the eddy-current losses over a conductive substrate is presented. The results are applicable to monolithic inductors and transformers, especially when such structures are realized over an epitaxial CMOS substrate. The technique is verified against measured results from 100 MHz to 14 GHz for spiral inductors.

Modern RFICs have achieved an impressively high integration level, making crosscoupling effects among different sections of the circuit a potential limit to their functionality. Integrated spiral inductors occupy a significant chip area and are a potential source of EM interference. This paper investigates the coupling effects between two planar spiral inductors. A physical model for the single...

In wireless communication systems, passive elements including tunable capacitors and inductors often need high quality factor ( -factor). In this paper, we present the design and modeling of a novel high -factor tunable capacitor with large tuning range and a high -factor vertical planar spiral inductor implemented in microelectromechanical system (MEMS) technology. Different from conventional ...