This paper proposes a Micro-electro-mechanical (MEMS) capacitive pressure sensor that relies on the movable electrode displaced like a flat plate equal to the maximum center deflection of diaphragm. The diaphragm, movable electrode and mechanical coupling are made of polysilicon, gold and Si3N4, respectively. The fixed electrode is gold and the substrate is Pyrex glass. This proposed method inc...

In this paper an introduction to substrate noise in silicon on insulator (SOI) is given. Differences between substrate noise coupling in conventional bulk CMOS and SOI CMOS are discussed and analyzed by simulations. The efficiency of common substrate noise reduction methods are also analyzed. Simulation results show that the advantage of the substrate isolation in SOI is only valid up to a freq...

For modern integrated circuits, capacitive coupling effects between interconnects can play an important role. Also resistive coupling effects via the substrate may have a significant influence on circuit behavior. This has already been recognized some time ago [1], and several methods to model these effects have been developed [2]. In this paper we will show how we can model coupling effects th...

In this paper a new procedure for designing forward-wave directional couplers using periodic shunt short circuited stubs is proposed. A new type of cell using these stubs, which enlarge the phase difference between even- and odd modes of a uniform microstrip coupled line is introduced. Using the equivalent circuit model for even- and odd-modes of the proposed cell, the elements of the  ABCD tra...

Coupling through common silicon substrate has become an important limiting factor in high-performance mixed-signal ICs. A study of the evolution of this type of interaction with technology scaling down is presented in this paper. The level of noise when devices and parasitic elements are scaled down is obtained for a typical situation. High performance and low power scaling scenarios are consid...

The vibrational properties of carbon monoxide adsorbed to the copper (100) surface are explored within density-functional theory. Atoms of the substrate and adsorbate are treated on an equal footing in order to examine the effect of substrate–adsorbate coupling. This coupling is found to have a significant effect on the vibrational modes, particularly the in-plane frustrated translation, which ...

While previous studies on substrate coupling focused mostly on noise induced through drain-bulk capacitance, substrate coupling from planar spiral inductors at radio frequency (RF) via the oxide capacitance has not been reported. This paper presents the experimental and simulation results of substrate noise induced through planar inductors. Experimental and simulation results reveal that isolat...

Chip-level substrate coupling analysis uses F-matrix computation with slice-and-stack execution to include highly concentrated substrate resistivity gradient. The technique that has been applied to evaluation of device-level isolation structures against substrate coupling is now developed into chip-level substrate noise analysis. A time-series divided parasitic capacitance (TSDPC) model is equi...

Substrate noise generated by large digital circuits degrades the performance of analog circuits sharing the same substrate. To simulate this performance degradation, the total amount of substrate noise must be known. For large digital circuits, the substrate simulation is however not feasible with a transistor-level simulator due to the long simulation times and high memory requirements. We are...