نتایج جستجو برای: thermal simulation
تعداد نتایج: 759981 فیلتر نتایج به سال:
In this paper we address the chip-level thermal simulation problem. Our work is based on some early results treating electro-thermal problems on circuit level 11, 22. The developed electro-thermal simulation package has been integrated under Cadence DFWII Opus. Due to its relatively low CPU need this package can be used as a thermal veriication tool of layouts of analog circuits. In our approac...
A thermal bridge is a part of the building envelope where the otherwise uniform thermal resistance is significantly changed by: • Full or partial penetration of the building envelope by materials with a different thermal conductivity and/or • A change in thickness of the structure and/or • A difference between internal and external areas, such as occur at wall-floor-ceiling junctions. INTRODUCT...
The aim of this investigation was to calculate the thermal properties of silver crystal in the presence of linear imperfection. The simulations were performed by molecular dynamics simulation technique in NPT as well as NVT ensemble based on quantum Sutton-Chen many body potential. The thermal properties including cohesive energy, melting temperature, isobaric heat capacity and thermal expansi...
A multilayer, full chip thermal analysis is presented. The design of the chip at functional-block level is directly captured to the simulator, allowing the assessment of the chip layout impact on the system performance due to the elevated operational temperature. The heat generation for each block is obtained by running the circuit-level electrical simulation separately on individual functional...
Small transistors and high clock frequency have resulted in high power density, which makes temperature a strong constraint in today’s microprocessor design. For maximizing performance, the thermal design power must be set according to average, instead of worst case, conditions. Consequently, current processors feature temperature sensors and throttling mechanisms to keep the chip temperature a...
in this study, a new method for joining aluminum tubes in subsurface structures using steel converting and aluminum welding are presented and reviewed. but near the weld area is under high thermal cycle and will cause residual stresses in heat affected zone. therefore for assessment of proposed connection from the perspective of residual stress by using the finite element method welding of tube...
thermal barrier coatings (tbcs) are used to provide thermal insulation to the hot section components of gas turbines in order to enhance the operating temperature and turbine efficiency. hot corrosion and thermal shocks are the main destructive factors in tbcs which comes as a result of oxygen and molten salt diffusion into the coating. in this thesis atmospheric plasma spraying was used to dep...
abstract according to increase in electricity consumption in one hand and power systemsreliability importance in another , fault location detection techniqueshave beenrecentlytaken to consideration. an algorithm based on collected data from both transmission line endsproposed in this thesis. in order to reducecapacitance effects of transmission line, distributed parametersof transmission line...
SHAHAB is a PC- based simulator developed by Olefin Research Group (ORG), with the simultaneous simulation of the reactor, the firebox, the convection section and the transfer line exchanger in steam Cracking units. The reaction mechanism of thermal cracking of hydrocarbons is generally accepted as free-radical chain reactions. Using a rigorous kinetic model, a complete reaction network for rep...
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