Due to increasing applications of extended surfaces as passive methods of cooling, study of thermal behaviors and development of mathematical solutions to nonlinear thermal models of extended surfaces have been the subjects of research in cooling technology over the years. In the thermal analysis of fin, various methods have been applied to solve the nonlinear thermal models. This paper focuses...

Thermal test structures and ring oscillators (ROs) are fabricated in 0.18-μm three-dimensional (3-D)–SOI technology. Measurements and electrothermal simulations show that thermal and parasitic effects due to 3-D packaging have a significant impact on circuit performance. A physical thermal model is parameterized to provide better prediction of circuit performance in 3-D technologies. Electrothe...

a nanofluid is a dilute liquid suspension of particles with at least one critical dimension smaller than ~100 nm. research works so far suggest that nanofluids offer excellent heat transfer enhancement over conventional base fluids. the enhancement depends on several factors such as particle shape, particle size distribution, volume fraction of nanoparticles, temperature, ph, and thermal conduc...

phenolic resins have been widely used for selective high technology applications due to their excellent ablative properties, structural integrity and thermal stability that make them appropriate for thermal insulation materials, wood products industry, coatings, moulding compounds and composite materials. polymer layered silicate nanocomposites based on montmorillonite (mmt) have attracted a gr...

Purpose – The functionality of personal mobile electronics continues to increase, in turn driving the demand for higher logic-to-memory bandwidth. However, the number of inputs/outputs supported by the current packaging technology is limited by the smallest achievable electrical line spacing, and the associated noise performance. Also, a growing trend in mobile systems is for the memory chips t...