We propose a universal MEMS technology platform for fabricating integrable passive components for radio frequency (RF) integrated circuits. This platform is based on a novel surface-micromachined MicroElevator by Self-Assembly (MESA) techque. Both high-Q inductors and variable capacitors can be realized by the MESA technology. A surface-micromachined spiral inductor that is raised by 250 pm abo...

This work introduces a tool for the optimization of CMOS integrated spiral inductors. The main objective of this tool is to offer designers a first approach for the determination of the inductor layout parameters. The core of the tool is a Genetic Algorithm (GA) optimization procedure where technology constraints on the inductor layout parameters are considered. Further constraints regarding in...

This paper presents the use of a new structure of active inductor named cascoded flippedactive inductor (CASFAI) in a T-type high-pass tunable output matching network of a class-E RF power amplifier (RFPA) to control the output power and enhance the efficiency. The designed CASFAI behaves as an inductor in the frequency range of 0-6.9 GHz, and has reached to a maximum quality factor of 4406, in...