Detailed three-dimensional finite element analysis was carried out for area-array solder-bumped flip-chip packages. The analysis enabled determinations of accurate three-dimensional effects on stress distributions as well as local fracture behaviors under thermal load. The 3D analysis also estimated thermal fatigue life of solder bumps. Since dimensions of various components span more than thre...

Resolvers are widely used in electric driven systems especially in high precision servomechanisms. Both encapsulated and pancake resolvers suffer from a major drawback: static eccentricity (SE). This drawback causes a significant increase in resolver output position error (RPE) which could not be corrected electronically. To reduce RPE, this paper proposes a novel structure with axial flux. Pr...

background: the salvage proximal femoral osteotomy is performed in mild or moderate osteoarthritis when the articulating surfaces are normal and relieves the subject’s pain. because the importance of angular mal-alignment of the femur bone at the hip junction accurate pre-op planning based on patient specific anatomy is required to prevent any lower limb misalignment and joint problem pre-opera...

this paper is about discrete sensitivity analysis. a triangular bending element with constant moment and six degrees of freedom is used. the required derivatives for sensitivity analysis are calculated explicitly. these formulations, finite element method and sequential linear programming are utilized to find shape optimization of plate bending structures. the numerical examples, which show the...

The elastic-plastic behavior of the material is considered to analyze the effect of an external circumferential crack on a pipe with thickness transition and double slopes. Using the extended finite element method (XFEM), the J-integral of 3D cracks were investigated and compared between straight pipes and pipes with thickness transition and different slopes. Considering internal press...

In this study, the finite element method was used to analyze scattering issue caused by various types of 3D structures coated with dielectrics on perfect electric conductors. To electromagnetic wave problem, we implemented an in-house analysis code based generalized Riesz principle, which is applicable a wide range boundary value problems. Through numerical experiments, accuracy and validity al...