In a diagram editor, one can distinguish initial from incremental diagram layout. The former computes a diagram layout from scratch, whereas the latter adjusts an existing layout after diagram modifications. In previous work, we have proposed a pattern-based approach as a solution for incremental diagram layout in visual language editors. Each LP encapsulates certain layout behavior. A diagram’...

In this paper, we describe a comprehensive layout methodology for bonded three-dimensional integrated circuits (3D ICs). In bonded 3D integration technology, parts of a circuit are fabricated on different wafers, and then, the wafers are bonded with a glue layer of Cu or polymer based adhesive. Using our layout methodology, designers can layout such 3D circuits with necessary information on int...

In this paper, a quaternion firefly algorithm is utilized to solve a multi-row facility layout design problem with the objective of minimizing the total cost of transportation. A quaternion firefly algorithm takes the motion of the firefly as a quaternion one. Consequently, the solution space is explored more accurately and the answers are of higher quality. That is, the answers are considerabl...

The cilia and flagella of eukaryotic cells function by active bending that produces cell movements and fluid flows in their environment. They contain a common cytoskeleton, known as the axoneme, that is the locus of all the enzymes and mechanical components that are required for production of useful bending. The bending of many flagella, and some cilia, is planar, or at least nearly planar. In ...

DNA bending plays an important role in many biological processes, but its molecular and energetic details as a function of base sequence remain to be fully understood. Using a recently developed restraint, we have studied the controlled bending of four different B-DNA oligomers using molecular dynamics simulations. Umbrella sampling with the AMBER program and the recent parmbsc0 force field yie...

Softness of human hair plays a big roll on the manageability of it. Therefore, it is important to measure the softness quantitatively. It is well known that the softness of long shaped materials can be obtained from tensile young's modulus and bending modulus. The tensile young's modulus is most generally empolyed as a parameter of softness, but is usually obtained by destructive way. Bending e...

In this paper, we describe a comprehensive layout methodology for bonded three-dimensional integrated circuits (3D ICs). In bonded 3D integration technology, parts of a circuit are fabricated on different wafers, and then, the wafers are bonded with a glue layer of Cu or polymer based adhesive. Using our layout methodology, designers can layout such 3D circuits with necessary information on int...