Today, layout verification for VLSI is a crucial part of IC design. However, for applicability, this must be both fast and accurate. Layout-to-circuit extractors can meet both these constraints. They quickly convert a layout into an equivalent network that accurately models that layout. Subsequently, circuit simulation and network comparison are convenient tools that enable accurate prediction ...

This paper describes a kind of vision chip, which is an integration of an image processing circuit with photo receptors, that has a function of extracting objects’ positions in focal plane. The objects’ positions are output as their coordinates, which are useful for further detailed image recognition processing. The extraction processing has two steps; first, the flags indicating the objects’ c...

We discuss a cellular-automata (CA) LSI core that extracts early features of objects in images, such as sizes and skeletons. A CMOS-image sensor with a CA core enables high-speed image processing. We propose an efficient CA algorithm based on rotated template matching. Each cell circuit in the proposed CA is implemented by a digital circuit, and transistors in each cell circuit number 198 in fu...

A self-organizing algorithm is developed for multivariate constrained modeling of general passive components. The algorithm builds compact, analytical circuit models and represents the scattering parameters of the passive components as a function of its geometrical parameters and as a function of the frequency. Multiple constraints, or relationships between the geometrical parameters, may exist...

A method is proposed and experimentally explored for in-situ calibration of complex transmission data for superconducting microwave resonators. This cryogenic calibration method accounts for the instrumental transmission response between the vector network analyzer reference plane and the device calibration plane. Once calibrated, the observed resonator response is analyzed in detail by two app...

Depending on the big data analysis becomes important, yield prediction using data from the semiconductor process is essential. In general, yield prediction and analysis of the causes of the failure are closely related. The purpose of this study is to analyze pattern affects the final test results using a die map based clustering. Many researches have been conducted using die data from the semic...

The purpose of failure analysis is to locate the source of a defect in order to characterize it, using different techniques (laser stimulation, light emission, electromagnetic emission...). Moreover, the aim of vulnerability analysis, and particularly side-channel analysis, is to observe and collect various leakages information of an integrated circuit (power consumption, electromagnetic emissi...