A simple process for forming sub-micron gaps between horizontal and vertical electrodes in a three-dimensional micro-electrode system without the need for high-resolution lithography is described. The process is based on the enhancement of ion milling rates in metals at oblique ion incidence, which allows the preferential erosion of metal at a mesa edge. Self-aligned electrode structures are fo...

We have fabricated sub-micron intrinsic Josephson junctions in thin films of Tl-Ba-Ca-Cu-O using two differing techniques suited to different applications. By using lateral focussed ion-beam milling we have created arrays of intrinsic junctions in -axis oriented films. Such arrays, with areas as low as 0.25 m, display large hysteresis comparable to that observed in single-crystal intrinsic junc...

BSA solutions of 10 %, 1 % and 0.1 % were prepared by addition of lyophilized BSA powder (Sigma Aldrich, St Louis, MO, USA) into deionized water before being filtered through a glass fiber filter (Whatman GF/F) under vacuum in order to remove particles that can clog the system. Tween 80 was then added to a obtain 0.05 % [V/V] solution. The BSA solutions were then refrigerated before use. All so...

The current vs. voltage and electrical breakdown behavior for devices with micron and sub-micron gaps between conductors is studied. The limitations of the well-known but often-misinterpreted Paschen curve are discussed. The little-known modified Paschen curve, that includes field emission effects so important in understanding breakdown behavior for devices with sub-micron gaps, is described. C...

This paper reports the use of a novel thermometry technique, scanning Joule expansion microscopy (SJEM), to study the steady state and dynamic thermal behavior of small geometry vias under sinusoidal and pulsed current stress for the first time. Spatial distribution of temperature rise surrounding a sub-micron via has been determined and the corresponding temperature contour image has been extr...

A 3-axis dispensing system is utilized to control the initiating and terminating fiber positions and trajectory via the dispensing software. The polymer fiber length and orientation is defined by the spatial positioning of the dispensing system 3-axis stages. The fiber diameter is defined by the prescribed dispense time of the dispensing system valve, the feed rate (the speed at which the stage...

Substrate noise effects caused by the integration of a DC-DC converter into a 0.13 μm CMOS technology integrated circuit are investigated in this paper. Simulations performed using the Substrate Noise Analyst tool show strong impact of switching and power supply noise on a sensitive analog block. The dependence of substrate noise coupling on physical separation distance, floorplanning and intro...

Innovation often emerges from spin-offs and imitation. Semiconductor processing, as typified by Very Large Scale Integration, is a very mature, high-technology industry, capable of producing components with sub-micron features and extremely closely monitored and controlled chemical compositions. There are many spin-off technologies, some of which have already been adopted in the coatings and me...