In this work a novel colour-difference measurement method for the quality evaluation of copper deposited on a polymer is proposed. Laser-induced selective activation (LISA) was performed onto the surface of the polycarbonate/acrylonitrile butadiene styrene (PC/ABS) polymer by using nanosecond laser irradiation. The laser activated PC/ABS polymer was copper plated by using the electroless copper...

For solder based flip-chip assembly, the deposition of an under bump metallisation (UBM) layer onto the surface of the AI bondpads of the die is the first step in the wafer bumping process. The UBM is necessary, as the fragile AI pad has a tenacious oxide layer that cannot be soldered without the use of strong fluxes and a barrier layer is required to prevent dissolution of the bondpad into the...

54 ELECTROLESS PLATING OF NICKELONTO 4,059,710 1 1/1977 Nishiyama .......................... 427/438 SURFACES SUCH AS COPPER OR FUSED 4,136,216 1/1979 Feldstein ....... ... 427/306 TUNGSTON 4,167,416 9/1979 Zola ......... ... 427/438 4,220,678 9/1980 Feldstein ... ... 427/305 75) Inventor: Jon E. Bengston, Newington, Conn. 4,239,813 12/1980 Murakami. ... 427A306 s 4,276,323 6/1981 Oka ............

We present a technique for patterning thin-film metals (silver and gold) without the need for photolithography. The technique involves microfluidics and can be performed on planar or curved surfaces. Patterns of thin-film metal are fabricated by flowing electroless silver or gold plating solutions through predefined microchannels made of polydimethylsiloxane sealed against a surface of interest...

In this study, UBM material systems for flip chip solder bumps on Cu pads were investigated using the electroless copper (E-Cu) and electroless nickel (E-Ni) plating methods; and the effects of the interfacial reaction between UBMs and Sn–36Pb–2Ag solders on the solder bump joint reliability were also investigated to optimize UBM materials for flip chip on Cu pads. For the E-Cu UBM, scallop-lik...

Abstract In this paper, the pressing and sintering properties of three kinds copper-coated chromium composite powder copper-chromium mechanical mixed with same copper content were compared studied. The was prepared by a diffusion method, liquid electroless plating method an added binder. results show that increase in content, advantage copper-clad is more obvious. density, hardness, size shrink...

In this study, with the aim of improving fatigue characteristics A7075 aluminum alloy, A7075-T6511 alloy rod specimens were plated electroless Ni–P different compositions, and evaluated by a rotary bending test. The strength specimen low-P type was higher than that un-plated specimen. However, high-P significantly lower specimen, medium-P also though extent not so significant. It speculated the...

This paper reports the utilization of capillary microfluidics to rapidly create nanostructure-patterned electrodes for energy storage applications. Using patterned photoresist as open-channel capillary microfluidics, Tobacco mosaic virus (TMV) bio-nanoscaffolds suspended in solution are autonomously delivered onto planar gold electrodes over a 1 cm2 area. The TMVs assemble on the electrode and ...