نتایج جستجو برای: humidity sensor ag cu

تعداد نتایج: 311258  

2010
Ming-Zhi Yang Ching-Liang Dai De-Hao Lu

This study presents the design and fabrication of a capacitive micro humidity sensor integrated with a five-stage ring oscillator circuit on chip using the complimentary metal oxide semiconductor (CMOS) process. The area of the humidity sensor chip is about 1 mm(2). The humidity sensor consists of a sensing capacitor and a sensing film. The sensing capacitor is constructed from spiral interdigi...

2015
John Ojur Dennis Abdelaziz Yousif Ahmed Mohd Haris M. Khir

This paper reports on the fabrication and characterization of a Complementary Metal Oxide Semiconductor-Microelectromechanical System (CMOS-MEMS) device with embedded microheater operated at relatively elevated temperatures (40 °C to 80 °C) for the purpose of relative humidity measurement. The sensing principle is based on the change in amplitude of the device due to adsorption or desorption of...

Journal: :Journal of Alloys and Compounds 2021

In this study plasma-assisted nitrogen doping of a CuO–NiO mixed oxide thin film was presented. The as prepared also applied glucose sensor. species generated during plasma ignition resulted in beneficial phase transformation CuO to Cu 2 O. Characterisation techniques such XRD, SEM, EIS and Hall Effect etc. measurements were utilized the morphology, structural features, profile electrical prope...

2015
Shailesh Narayan Joshi Greg Maxwell Steve Hoff Eugene Takle Maria Corsi

Relative humidity sensors are common components in building heating, ventilating, and air-conditioning (HVAC) systems, and their performance can significantly impact energy use in these systems. A study was undertaken to test and evaluate the most commonly used relative humidity sensors in building HVAC systems, namely the capacitive and resistive types. Sensor models from six different manufac...

Journal: :Research on Chemical Intermediates 2022

The main focus of the current research is bio-nano-technologically produced nanoparticles (NPs) utilizing waste materials. There a need for developing advanced technology to reduce in an eco-friendly way. Therefore, presently discarded aqueous portion Prosopis cineraria pod was used after boiling, synthesize Ag and Ag–Cu NPs. FT-IR spectra illustrated presence phenyl propenoids flavonoids displ...

Journal: :Lab on a chip 2013
Joseph Parisi Liang Su Yu Lei

A microfluidic device with integrated novel silver nanoparticle (Ag NPs) decorated nanowall structures was fabricated via in situ electrodeposition of Cu-core/C-sheath nanowalls, followed by a facile in-channel silver galvanic replacement reaction method at room temperature. The integrated microfluidic devices with Ag NPs decorated nanowalls, serving as a highly active Raman substrate, were the...

Journal: :Biosensors & bioelectronics 2007
G Steven Huang Meng-Te Wang Chia-Wei Su Yu-Shiun Chen Meng-Yen Hong

A heavy metal ion sensor was constructed by cross-linking melanin onto the gold electrode of quartz crystal microbalance (QCM). A mercury ion sensitivity of 518+/-37 Hz/ppm was observed, a substantial increase in sensitivity compared to previous reports of 10-50 Hz/ppm with the limit of detection at 5 ppb. Detection of other metal ions including Sn(2+), Ge(4+), Li(+), Zn(2+), Cu(2+), Bi(3+), Co...

2008
Sung Pil Lee Ji Gong Lee Shaestagir Chowdhury

An integrated humidity sensor system with nano-structured carbon nitride film as humidity sensing material is fabricated by a 0.8 μm analog mixed CMOS process. The integrated sensor system consists of differential humidity sensitive field effect transistors (HUSFET), temperature sensor, and operational amplifier. The process contains two poly, two metal and twin well technology. To form CNx fil...

2008
H. M. Wu TUNG-HAN CHUANG HUI-MIN WU

Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with Ag/Cu pads are investigated. After reflow, scallop-shaped ␩-Cu 6 Sn 5 and continuous planar ␩-(Cu 0.9 Ni 0.1) 6 Sn 5 intermetallics appear at the interfaces of the Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder joints, respectively. In the case of the Sn3Ag0.5Cu specimens, an additional ␧-Cu 3 Sn intermetallic layer is formed at the interface betwee...

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