In this paper, a process for the microfabrication of a wafer-scale palladium—silver alloy membrane (Pd–Ag) is presented. Pd–Ag alloy films containing 23 wt% Ag were prepared by co-sputtering from pure Pd and Ag targets. The films were deposited on the unetched side of a 110 -oriented silicon wafer in which deep grooves were etched in a concentrated KOH solution, leaving silicon membranes with a...

Graphene oxide (GO) with its unique two-dimensional structure offers an emerging platform for designing advanced gas separation membranes that allow highly selective transport of hydrogen molecules. Nevertheless, further tuning...

Hydrogen bond is a typical noncovalent bond with its strength only one-tenth of a general covalent bond. Because of its easiness to fracture and re-formation, materials based on hydrogen bonds can enable a reversible behavior in their assembly and other properties, which supplies advantages in fabrication and recyclability. In this paper, hydrogen bond nanoscale networks have been utilized to s...

Submicron thick palladium–silver alloy films with 23 wt.% of silver (Pd–Ag23) have been synthesized by simultaneous sputtering from pure targets of Pd and Ag. Full characterization of the deposited films was performed by using X-ray photoelectron spectroscopy, highresolution scanning electron microscopy, high-resolution transmission electron microscopy, and X-ray diffraction. The analytical res...