Phase locked loop (PLL) is a technique which has contributed significantly toward the technology advancement in communication and motor servo control systems. Inventions in PLL schemes combining with novel integrated circuit have made PLL devices important system components. The development of better modular PLL integrated circuit is continuing. As a result, it is expected that it will contribu...

For the development of the 4G wireless networks the design of seamless and efficient Vertical handovers is an essential issue. Next generation wireless communications will likely rely on integrated networks consisting of multiple wireless technologies. So the integration of WiMAX with other wireless technologies, such as WLAN, Wi-Fi, UMTS or 3G, has attracted research community for the last few...

A new microelectronics packaging technique, called Solid logic Technology (SLT), utilizes silicon planar glass-encapsulated transistors and diodes, and graphic arts techniques for producing high-quality, passive components having tight tolerances. The result is a process permitting the low-cost realization of a variety of versatile, high-performance circuit modules. The salient features of SLT ...

For the development of the 4G wireless networks the design of seamless and efficient Vertical handovers is an essential issue. Next generation wireless communications will likely rely on integrated networks consisting of multiple wireless technologies. So the integration of WiMAX with other wireless technologies, such as WLAN, Wi-Fi, UMTS or 3G, has attracted research community for the last few...

Hardware/Software co-design is an increasingly common design style for integrated circuits. It allows the majority of a system to designed quickly with standardized parts, while special purpose hardware is used for the time critical portions of the system. The framework considered in this paper performs Hardware/Multi-Software (HMS) co-design for iterative loops, given an input speciication tha...

Copper plating baths used for forming integrated circuit interconnects typically contain three or four component additive mixtures which facilitate the superfilling of via holes and trench lines during damascene plating. Extensive study over the last two decades has provided researchers with an understanding of the underlying mechanisms. The role of cuprous intermediates in the copper depositio...

Total on-chip interconnect length has been increasing exponentially with technology scaling. Consequently, interconnect-driven design is an emerging trend in state-ofthe-art integrated circuits. Cu-based interconnect technology is expected to meet some of the challenges of technology scaling. However, Cu interconnects still pose a reliability concern due to electromigration-induced failure over...

This paper presents novel on-chip antenna structures and provides new on-chip circuit concepts that may be implemented as part of standard integrated circuit fabrication processes for wireless integrated circuits of the future. As wavelengths of wireless local area networks (V\'LANs) and personal area networks (PANs) shrink to millimeter lengths at 60 GHz and above, interconnectivity issues and...