In this paper a new approach to an automatic controlled system of manufactured parts is suggested. Inputs of the system are: an unordered cloud of 3D points of the part and its CAD model in IGES and STL formats. The 3D cloud is obtained from a high resolution 3D range sensor. After registration between the cloud of points and the STL CAD model, the cloud is segmented by computing the minimal di...

In modern manufacturing systems, two developments are paramount: flexible automation computer systems controlling and monitoring the physical processes, and Computer Integrated Manufacturing (CIM) direct data sharing among production control systems and the engineering and administrative systems that support them. The resulting data systems engineering task is to provide access from many system...

The crossword puzzle is a classic pastime that is well-known all over the world. We consider the crossword manufacturing process in more detail, investigating a two-step approach, first generating a mask, which is an empty crossword puzzle skeleton, and then filling the mask with words from a given dictionary to obtain a valid crossword. We show that the whole manufacturing process is NP-comple...

In today's highly competitive intellectual environments which force top management to constantly looking for better improvement and making the best decisions in shortest possible time and within limited resources. Managers in manufacturing companies need to have strong capability of adaptation mainly because of the dynamic relationships that must be established between manufacturing units. To a...

Product form queueing networks (PFQN) and generalized stochastic Petri nets (GSPN) have emerged as the principal performance modelling tools for flexible manufacturing systems (FMS). In this paper, we present integrated PFQN-GSPN models, which combine the computational efficiency of PFQN and representational power of GSPN by employing the principle of flow-equivalence. We show that FMS that inc...

The configuration design of complex integrated manufacturing systems such as semiconductor wafer fabricaton plants is a multi-objective, multi-criterion design problem. This paper describes a qualitative reasoning methodology for the automated configuration design of manufacturing systems. The amounts, incremental qualitatives, and rates of change that make up the components of a qualitative mo...

Three-dimensional integrated circuits (3D ICs) introduce wafer bonding and Through Silicon Vias (TSVs) as new modules, thus extending manufacturing requirements beyond CMOS. A 3D IC with a photosensor is taken as an example to further analyze the resulting new metrology requirements for mass production. For the wafer bond module, data on defects before and after bonding, bond interface adhesion...